Pre-Procurement

Posted by Susana Galdeano
On December 5, 2020
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The pre-procurement phase combines the EEE parts state-of-the-art analysis, risk analysis and component ownership cost optimization with regards to the mission requirements, design criticality and budget. In order to achieve this, the project manager leading a multidisciplinary team must find the optimal balance between component information availability (traceability, materials, testing, previous use…) and minimum tests to perform, reaching an acceptable level of reliability covering the technical, schedule and costing constraints.

Post Procurement and Components Control/Validation

Posted by Susana Galdeano
On December 5, 2020
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Once the pre-procurement and procurement activities have been considered, the project manager and the different team members will ensure that the whole process to validate commercial components is performed accordingly in a timely manner.

MIL-STD-883 METHOD 2003 – Solderability Testing

Posted by Manuel Padial Pérez
On July 23, 2020
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The Mil-Std-883 Method 2003 Is One Of The Oldest And Most Widely Used Standards For Solderability Testing.

Outgassing and Mating Test

Posted by Pedro CARABIAS LÓPEZ
On May 6, 2020
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ALTER performed Outgassing and Mating Test on High Voltage Connectors with the aim to ensure the proper parts reliability during Solar Orbiter ESA/NASA Mission

Quality Issues in the procurement of Operational Amplifiers

Posted by Antonio Rodríguez Arenas
On April 20, 2020
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The Quality Assurance in EEE parts is a major aspect to take care in the procurement for EEE parts. One family of EEE parts widely used are the Operational Amplifiers which are in much different equipment’s of satellites electronics

Analog to digital converters: The resolution dilemma

Posted by José Francisco Largaespada
On April 19, 2020
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High resolution always pays the penalty of lower sampling rates, which can also derive in a poor representation of the analog signal

EEE Parts Solderability Testing

Posted by Manuel Padial Pérez
On March 28, 2020
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Solderability testing refers to the process of evaluating the solderability of terminations (i.e., component leads, lugs, terminals, wires, etc.). which are normally joined by a soldering operation. The solderability determination is based on the ability of the terminations to be wetted by the molten solder after accelerated aging.

Savers for ESCC Circular Connectors 38999 Type

Posted by Manuel Sánchez Ruiz
On January 24, 2020
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ESCC (European Space Components Coordination) released several Detail Specifications to guide European manufacturers on the manufacture and testing of the different series of MIL-DTL-38999 (series I, series II and series III) for Space applications.

MICROCHIP FPGAs External Visual Inspection Considerations

Posted by Antonio Rodríguez Arenas
On January 20, 2020
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One of the quality assurance inspections that are performed in EEE parts is external visual inspection. The applicable method for Microchip FPGAs as well as for other parts with generic specification MIL-PRF-38535, is MIL-STD-883 Method 2009.

Hot Solder Dip Acceptance Criteria

Posted by Antonio Rodríguez Arenas
On December 20, 2019
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Hot Solder Dip Acceptance Criteria for Flat Pack Packages. Different standards can be considered to determine the acceptance of the Hot Solder Dip activity on EEE components