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Physicists Linking Magnetism and Electronic-​band Topology

  • Posted by doEEEt Media Group
  • On May 27, 2022
  • 0
Dirac matter is an intriguing class of materials with rather peculiar properties: electrons in these materials behave as if they had no mass. The most prominent Dirac material is graphene, but further members have been discovered during the past 15 years or so. Each one of them serves as a rich playground for exploring ‘exotic’ electronic behaviours, some of which hold the promise to enable novel components for electronics.
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High Precision Compact Thin Film Wraparound Chip Resistor

  • Posted by doEEEt Media Group
  • On May 26, 2022
  • 0
New high precision thin film wraparound chip resistor for industrial, military, and aerospace applications. In addition to offering the widest resistance value range on the market, the Vishay Sfernice PEP delivers higher power ratings in smaller case sizes than competing devices, enabling miniaturization and increasing reliability by reducing mechanical stress on solder joints.
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Ultra-Low Loss Shielded Power Inductors

  • Posted by doEEEt Media Group
  • On May 26, 2022
  • 0
XGL3520 molded power inductors that offer the lowest DC and shallow AC losses for a wide range of DC-DC converters. Additional performance benefits include a more comprehensive range of inductance values and improved Irms current ratings.
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Vishay Introduces Highest Energy Density Wet Tantalum Capacitors

  • Posted by doEEEt Media Group
  • On May 26, 2022
  • 0
New EP2 high energy wet tantalum capacitor that delivers the industry’s highest capacitance per voltage rating and case size for this device type. Vishay Intertechnology EP2 wet tantalum capacitor offers industry-high capacitance and mechanical robustness for military and avionics systems.
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3D Systems to Deliver 3D Printed RF Components

  • Posted by doEEEt Media Group
  • On May 26, 2022
  • 0
3D Systems announced Airbus Defence and Space had selected the company to produce critical components for its industry-first satellite innovation, OneSat. 3D Systems’ Application Innovation Group (AIG) has designed an end-to-end additive manufacturing solution – comprising materials, 3D printing technology, software, and applications expertise – to produce the components required for the large antenna array on these satellites.
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