Supercapacitors also called electrochemical double layer capacitors are energy storage devices storing a high volume of electric energy in the double layer between a high surface area electrode and an electrolyte. As compared to batteries no chemical reactions should occur at the electrodes.
PIND ( Particle Impact Noise Detection Test ) testing is performed in order to detect the presence of loose particles inside a device cavity.
Loose particle contamination is often caused by dirt, fibers, solder residues and other elements trapped inside the cavity during the sealing process. Loose particles can be a cause of electrical anomalies (or other physical problems) which in their turn can cause abnormal functioning of the parts and affect their reliability.
Red Plague is problematic corrosion appearing on silver-plated copper conductors. An electromechanical reaction is induced between copper core and silver plating of the conductor (by means of moisture and oxygen present in the silver-copper interface). Wire affected by Red Plague is mechanically compromised, increasing the failure risk linked to severe vibration and shock conditions on space flight.
Decapsulation of packaged devices exposes the internal elements of the device under test. Opening devices by this method allows the inspection of the die, interconnects and other features typically examined during failure analysis (FA), constructional analysis (CA) and destructive physical analysis (DPA).
The cross-sectioning process provides access to the device internal structure, its materials and design. Such components as diodes and capacitors and silicon dice are often subjected to cross-sectioning to detect the defects which could not be found using other testing techniques.
The procurement, evaluation, screening and lot acceptance of RF devices in leadless SMD packages to be used in spacecraft applications show unexpected difficulties whenever de-golding or retinning processes are required. This is associated to the induced lack of coplanarity in the contacts after those.
What are the optimum soldering conditions and solder fillet? The best solder fillet for all SMT applications is one which makes a reliable connection and which best withstands the environmental exposures of the products with minimum degradation. This fillet is difficult to describe quantitatively for all parts. The optimum fillet ranges in height from about 1/3 to 2/3 of the part termination height. This does not mean that all solder joints outside of this range should be repaired. It does mean that this is the target for the process engineer to reach for in his process. As many as possible of the solder fillets on the board should be in this range.
Lead integrity test is performed to determine the integrity of the device leads (terminals), welds and seals. During the execution of this test, the DUT is subjected to various stresses including tension, bending fatigue and torque. The stresses to be applied depend on the DUT characteristics and on the corresponding test method.