Insertion-loss measurements of ferrite absorber sheets

Posted by doEEEt Media Group
On August 7, 2019
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The development of stealth aircraft brought about the use of ferrite absorber sheets, which have proven useful for damping cavity resonances at microwave frequencies. Since then, ferrite absorber sheets have become useful at mitigating EMI

Using Resistors for Current Sensing

Posted by doEEEt Media Group
On July 29, 2019
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Sensing current by measuring voltage across a resistor is simple and elegant, but issues arise with the electrical interface, sizing and selection, and thermal/mechanical considerations

Water ingress through delaminated parts in plastic encapsulated systems

Posted by Francisco Javier Aparicio Rebollo
On July 25, 2019
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High-current low dropout regulator encapsulated in a TO-263 package is inspected by scanning acoustic microscopy. Probe frequency and inspection procedure is adapted to system characteristics. In this case the architecture of the system includes features at different depths within a thick package.

What does Acceptance Quality Limit (AQL) mean?

Posted by Manuel Padial Pérez
On July 19, 2019
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This post gives very general concepts of Acceptance Quality Limit (AQL) getting the user familiar with AQL Tables

Video Extreme Temperature Testing at Alter Technology

Posted by doEEEt Media Group
On July 8, 2019
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New space missions include more extreme requirements of storage, operational temperatures, and vacuum conditions, and all this testing can be done in our laboratories at Alter Technology.

Doing a Confocal Acoustic Inspection on Optoelectronic Components

Posted by Francisco Javier Aparicio Rebollo
On July 3, 2019
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An Infra-red led emitter is inspected by scanning acoustic microscopy. Probe frequency is adapted to the characteristics of the system. In this case, considering the large thickness of the package a 50 MHz transducer is used. Our phase inversion algorithm identifies and highlights the delaminated areas. In addition, A-scan inspection is used to confirm these findings.

Need a 3D Characterization Testing? Use Scanning Microscopy CLSM

Posted by Fernando Teberio
On July 2, 2019
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Modern manufacturing techniques depend on 3D measurement data combined with CAD/CAM techniques for quality control of high-precision components or mass production. Typically, contact measurement has been widely utilized by the industry. However, for complex and small 3D structures, the application of contact measurement is cumbersome or sometimes impossible. Therefore, noncontact measurement has gradually received much attention from researchers and industry.

Inspection of thick EEE plastic encapsulated parts – CSAM Services

Posted by Francisco Javier Aparicio Rebollo
On June 27, 2019
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High-resolution inspection of plastic encapsulated systems with complex internal architectures requires of confocal imaging techniques to block out-of-focus features that otherwise impair the resolution and the image quality.

Advanced Techniques in EEE Components Testing for Space applications

Posted by doEEEt Media Group
On June 24, 2019
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The reliability of the components used in a spacecraft is a determinating factor for their operation and performance throughout the mission life. Only the most advanced techniques are able to provide the depth and accuracy in the inspections required by current state of the art microelectronics.

Video Digging into Circuit Alter Technology

Posted by doEEEt Media Group
On June 17, 2019
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For satellite applications where failure is not an option, electronic components need to operate constantly on demand, and have to be free of failures during the lifetime of the satellite-which can be for many years. To ensure this requirement is met, the components are put through many hours of stress testing covering all thermal.