Thermo-Mechanical Analysis

Posted by Raquel Irene Cano Cordero
On August 9, 2021
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The thermomechanical analysis (TMA) of plastic encapsulated microelectronic, and COTS parts is a fundamental technique to avoid (during the design and fabrication stage) and foresee anomalies related to the deformation of packages with temperature. Thus, this is a very effective tool to disclose and screen out possible reliability concerns related to the thermo-mechanical integrity and stability of the devices.

Importance of the SAM for delamination detection

Posted by Raquel Irene Cano Cordero
On July 13, 2021
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SAM for delamination detection. Scanning Acoustic Microscopy is a technique that has revealed as the most effective and complete non-destructive approach for the detection of critical and latent anomalies within plastic encapsulated parts

Tomography 3D

Posted by Raquel Irene Cano Cordero
On July 2, 2021
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Tomography 3D is widely used in: Aerospace industries. ESCC 20900 – ASTM E1742 – … Military defense. MIL-STD-883, TM 2012 – MIL-STD-750, TM 2076 – MIL-STD-202, TM 209 – … Manufacturing industries. Automotive industries. Transport industries.

Webinar – SAM: Non-destructive inspection of plastic COTS parts and beyond

Posted by doEEEt Media Group
On June 14, 2021
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The present communication reports about i) the suitability of advanced acoustic microscopy techniques for the screening of plastic COTS devices susceptible to experience catastrophic failures and ii) the applicability of this technique in the inspection and failure analysis of systems besides COTS such as PCBs, metallic assemblies, hermetic packages, electronic potting, RF devices, and others

Evaluation of Optoelectronic Components for Space Applications

Posted by doEEEt Media Group
On June 10, 2021
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Solutions offered by Alter Technology Laboratories COTS and PEMS Qualification Upscreening / Upgrading Evaluation of New Products EMC Simulation Engineering and Consultancy Environmental Testing Parts Procurement Management Laboratory Services

Supercapacitors for Space, Qualification of COTS

Posted by doEEEt Media Group
On April 29, 2021
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Supercapacitors also called electrochemical double layer capacitors are energy storage devices storing a high volume of electric energy in the double layer between a high surface area electrode and an electrolyte. As compared to batteries no chemical reactions should occur at the electrodes.

Flammability UL94 and What It Means

Posted by doEEEt Media Group
On March 23, 2021
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UL94 flammability test that are referred by number of manufacturers using plastic materials such as moulding packages? Omnexus, the material selection platform for plastic material by SpecialChem provides an overview of the test in details.

Non-Destructive Detection of Delaminations in PCBs Assemblies

Posted by Raquel Irene Cano Cordero
On March 10, 2021
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5 likes

Scanning Acoustic Microscopy (C-SAM) inspection has been used for the comprehensive inspection of the lead-frame in a horizontally stacked capacitor. This non-destructive inspection reveals minor anomalies at the interface with capacitor terminals which may impair the electrical response.

SAM Capabilities, Analyse the internal structure in EEE Parts

Posted by Francisco Javier Aparicio Rebollo
On February 24, 2021
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3 likes

In acoustic microscopy, resolution and inspection depth is an inversely related parameter that depends on the probe frequency and the characteristics of the involved materials. Therefore, the inspection frequency must be carefully selected in order to optimize the accuracy without decreasing the inspection depth below the specimen thickness. Suitable selection of the inspection parameters provides: Detection of ultra-thin (submicrometric) delamination in multilayer systems. Micrometric lateral resolution. In acoustic microscopy, resolution and inspection depth is an inversely related parameter that depends on the probe frequency and the characteristics of the involved materials.

Verifying the Structural Quality of the Glassivation Layer

Posted by Francisco Javier Aparicio Rebollo
On February 21, 2021
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This test is performed to verify the structural quality of the glassivation layer in aluminum metalized semiconductor devices or microcircuits. The glassivation layer is a deposited dielectric film (e.g., CVD, sputtered of electron beam evaporated glass or nitride, etc.) and its good condition is essential to avoid such problems as electromigration.