Are there Voids in your IC Plastic Molding?

Posted by Raquel Irene Cano Cordero
On November 10, 2021
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Voids are defined as a lack of material within the bulk of the moulding compound and are common in ICs since they appear during improper molding manufacturing (injection, extrusion, etc.) and curation.

COTS in space: Does delamination really cause critical failures?

Posted by Emilio Cano García
On October 20, 2021
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One of the biggest cons of COTS is the plastic package. Plastic can cause outgassing, coating nearby components in chemicals that cause corrosion. Besides, the non-hermetic sealing can also allow humidity into packages, ultimately leading to corrosion of the semiconductor inside.

New climatic chamber

Posted by doEEEt Media Group
On October 6, 2021
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New acquisition will allow us to increase our current Environmental capabilities and offer the best price and delivery time in the market for the thermal treatment of your products, PCBs, as part of the Product Validation according to most of the industry standards ECSS-Q-ST-70-08C, ECSS-Q-ST-70-38C, JESD22-104, IEC 61646 10.11, IEC 60068-3-5…

Thermo-Mechanical Analysis

Posted by Raquel Irene Cano Cordero
On August 9, 2021
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The thermomechanical analysis (TMA) of plastic encapsulated microelectronic, and COTS parts is a fundamental technique to avoid (during the design and fabrication stage) and foresee anomalies related to the deformation of packages with temperature. Thus, this is a very effective tool to disclose and screen out possible reliability concerns related to the thermo-mechanical integrity and stability of the devices.

Importance of the SAM for delamination detection

Posted by Raquel Irene Cano Cordero
On July 13, 2021
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SAM for delamination detection. Scanning Acoustic Microscopy is a technique that has revealed as the most effective and complete non-destructive approach for the detection of critical and latent anomalies within plastic encapsulated parts

Tomography 3D

Posted by Raquel Irene Cano Cordero
On July 2, 2021
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Tomography 3D is widely used in: Aerospace industries. ESCC 20900 – ASTM E1742 – … Military defense. MIL-STD-883, TM 2012 – MIL-STD-750, TM 2076 – MIL-STD-202, TM 209 – … Manufacturing industries. Automotive industries. Transport industries.

Webinar – SAM: Non-destructive inspection of plastic COTS parts and beyond

Posted by doEEEt Media Group
On June 14, 2021
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The present communication reports about i) the suitability of advanced acoustic microscopy techniques for the screening of plastic COTS devices susceptible to experience catastrophic failures and ii) the applicability of this technique in the inspection and failure analysis of systems besides COTS such as PCBs, metallic assemblies, hermetic packages, electronic potting, RF devices, and others

Evaluation of Optoelectronic Components for Space Applications

Posted by doEEEt Media Group
On June 10, 2021
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Solutions offered by Alter Technology Laboratories COTS and PEMS Qualification Upscreening / Upgrading Evaluation of New Products EMC Simulation Engineering and Consultancy Environmental Testing Parts Procurement Management Laboratory Services

Press-Fit connectors qualification for space

Posted by Francisco Javier Aparicio Rebollo
On May 15, 2021
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The burgeoning demand for the incorporation of disruptive technologies into space industry clearly requires fast and reliable procedures for the space qualification of these innovative components.

Supercapacitors for Space, Qualification of COTS

Posted by doEEEt Media Group
On April 29, 2021
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Supercapacitors also called electrochemical double layer capacitors are energy storage devices storing a high volume of electric energy in the double layer between a high surface area electrode and an electrolyte. As compared to batteries no chemical reactions should occur at the electrodes.

INSPECTION, ELECTRICAL & VERIFICATION