X-Ray Inspection applied to Screening Test

Posted by doEEEt Media Group
On April 26, 2022
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Screening procedures assist in achieving quality and reliability levels commensurate with the intended application. The screening test does not increase the reliability of the components but removes those showing weakness or defects.

Characteristics of X-RAY Inspection

Posted by doEEEt Media Group
On April 26, 2022
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Radiographic inspection is based on X-ray radiation. This radiation can be produced by accelerating electrons under a certain voltage in a vacuum tube so that they are emitted from a cathode and collide into an anode called ‘target’ producing X-rays.

X-Ray Inspection applied to DPA test

Posted by doEEEt Media Group
On April 26, 2022
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During the DPA test, parts go through a systematic and detailed examination at different levels of disassembly. It is important to note that DPA is not a test itself, but rather a comprehensive series of tests where parts are examined for a wide variety of design, workmanship, and processing problems.

X-Ray Inspection applied to Constructional Analysis Tests

Posted by doEEEt Media Group
On April 26, 2022
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Constructional Analysis as a complete service provides a deep understanding of the technologies used during the manufacturing process, information about the construction of their device

Scanning Acoustic Microscopy (SAM) and X-Ray Tomography

Posted by doEEEt Media Group
On April 26, 2022
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The Scanning Acoustic Microscopy (SAM) technique is the most effective and complete non-destructive approach for the detection of critical and latent anomalies within plastic encapsulated parts, either on assembled or non-assembled systems

Advantages of SAM for microelectronics inspection

Posted by Javier Alejandro de la Ossa Fernández
On March 10, 2022
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SAM provides non-destructive imaging of defects and delamination in die and package materials. It is widely used to inspect microelectronics parts such as plastic encapsulated ICs, flip-chip systems, bonded wafers, printed circuit boards (PCBs), etc. It is particularly useful for the inspection of small and complex devices. SAM is highly sensitive to defects that commonly originate under different stresses during manufacturing.

Download FAQs – Scanning Acoustic Microscopy

Posted by Raquel Irene Cano Cordero
On February 23, 2022
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Over the years, our experience in CSAM testing has allowed us, among other things, to have conversations with clients who have come to us with questions about our laboratory services. In ALTER, we are an expert and reliable supplier in the engineering and testing EEE components and equipment for space and other technology markets. This article reports the importance of X-Ray Tomography, Scanning Acoustic Microscopy (SAM), and Cross Section techniques, and the advantages of their combined use for accurate testing.

Webinar – Development of hermetic optocouplers and other optoelectronic devices for space applications

Posted by doEEEt Media Group
On February 21, 2022
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Optoi has developed hermetic optocouplers, in previous activities funded by ESA. On a first project, the devices have been subjected to a full ESCC campaign following ESCC 2265000. This activity allowed the determination of the device’s functional boundaries and included a radiation campaign.

SAM: Survey to manufacturers and users

Posted by Francisco Javier Aparicio Rebollo
On February 17, 2022
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Do you perform/consider the initial qualification and/or periodic production validation with C-SAM (or other SAM tests)? What acceptance or reject criteria do you use for C-SAM (or other SAM tests)?

Test combination for detecting defects in plastic ICs

Posted by Raquel Irene Cano Cordero
On February 10, 2022
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Importance Of Combining X-Ray Tomography, Scanning Acoustic Microscopy (SAM), And Cross Section Techniques For Electronic Components Inspections This article reports the importance of X-Ray Tomography, Scanning Acoustic Microscopy (SAM), and Cross Section techniques, and the advantages of their combined use for accurate testing.