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Virtual Vibration Laboratory

  • Posted by María Teresa Rodríguez
  • On February 8, 2021
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Alter Technology developed an online platform where the customer can design its own test solution specifically adapted to the actual needs and requirements and monitor the result in real-time, without the need to wait to complete all the activities.
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Vibration Services & Acreditations

  • Posted by María Teresa Rodríguez
  • On February 8, 2021
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Vibration Testing is a very specialized field where Alter Technology is a highly qualified laboratory performing numerous tests in EEE Parts. To do all this kind our services that our expert brings to you, we have extended and qualified accreditations that bring to your needs a secure and safe work.
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Vibration Laboratory Equipment

  • Posted by María Teresa Rodríguez
  • On February 8, 2021
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At Alter Technology we offer a full Laboratory Equipment for any needs in differents type and shapes of the Hi-Rel Components with an expert group that will support you in all the process.
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A comparison between Red Plague screening methods

  • Posted by Manuel Sánchez Ruiz
  • On February 1, 2021
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Red Plague is problematic corrosion appearing on silver-plated copper conductors. An electromechanical reaction is induced between copper core and silver plating of the conductor (by means of moisture and oxygen present in the silver-copper interface). Wire affected by Red Plague is mechanically compromised, increasing the failure risk linked to severe vibration and shock conditions on space flight.
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SAM, the preferred method for the non-destructive internal inspection

  • Posted by doEEEt Media Group
  • On December 16, 2020
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    • 2 likes
SAM, The Preferred Method For The Non-Destructive Internal Inspection. Scanning Acoustic Microscopy of COTS and plastic encapsulated microelectronics. Confocal Scanning Acoustic Microscopy (C-SAM) has proved to be the most effective non-destructive approach for the screening of COTS parts and the detection of latent internal anomalies in PEMs, either before soldering or for assembled systems.
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Material Analysis Techniques for Electronic Components

  • Posted by Francisco Javier Aparicio Rebollo
  • On December 6, 2020
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    • 1 likes
Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify potential reliability issues such as undesirable whisker growth caused by pure tin finishes. Lead finish validation for every component type to be soldered is essencial to determine the correct soldering profile.
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Industry Applications where C-SAM is used

  • Posted by Francisco Javier Aparicio Rebollo
  • On November 29, 2020
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C-SAM is a reliable and powerful tool for the non-destructive testing of microelectronic parts and base materials. Moreover, it is mandatory for different applications such as those described below for different sectors. In order to provide a fast reply to our customer needs our Virtual Lab platform for Remote Testing grants immediate access to our test results and fast communication with our engineers during and after the test.
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Looking at Device Internal Structure by a Cross sectioning of EEE Parts

  • Posted by Francisco Javier Aparicio Rebollo
  • On November 27, 2020
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The cross-sectioning process provides access to the device internal structure, its materials and design. Such components as diodes and capacitors and silicon dice are often subjected to cross-sectioning to detect the defects which could not be found using other testing techniques.
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