SAM for delamination detection. Scanning Acoustic Microscopy is a technique that has revealed as the most effective and complete non-destructive approach for the detection of critical and latent anomalies within plastic encapsulated parts
A Lot Acceptance Test (LAT) is a reduced set of Qualification tests over components or equipment, required to accept a specific manufacturing lot for its use. A LAT sequence allows customers to have complete traceability of the components they are going to use in their application, starting from the wafer used during manufacturing.
The present communication reports about i) the suitability of advanced acoustic microscopy techniques for the screening of plastic COTS devices susceptible to experience catastrophic failures and ii) the applicability of this technique in the inspection and failure analysis of systems besides COTS such as PCBs, metallic assemblies, hermetic packages, electronic potting, RF devices, and others
Supercapacitors also called electrochemical double layer capacitors are energy storage devices storing a high volume of electric energy in the double layer between a high surface area electrode and an electrolyte. As compared to batteries no chemical reactions should occur at the electrodes.
Electronic Components Thermal shock testing is performed to determine the ability of parts to function properly in an environment with sudden extreme changes in temperature. It is also used for accelerated testing during product evaluation and qualification process.
PIND ( Particle Impact Noise Detection Test ) testing is performed in order to detect the presence of loose particles inside a device cavity.
Loose particle contamination is often caused by dirt, fibers, solder residues and other elements trapped inside the cavity during the sealing process. Loose particles can be a cause of electrical anomalies (or other physical problems) which in their turn can cause abnormal functioning of the parts and affect their reliability.
Scanning Acoustic Microscopy (C-SAM) inspection has been used for the comprehensive inspection of the lead-frame in a horizontally stacked capacitor. This non-destructive inspection reveals minor anomalies at the interface with capacitor terminals which may impair the electrical response.