The performance of PCB systems are sensitive to variations in the plating thickness of its vias, depends on the current/time in the copper plating bath and the throwing power. Insufficient plating thickness reduces the mechanical and thermal properties of the board and may lead to fatigue or overstress cracking, such us corner cracking and barrel cracking described below.

Electronic Components Thermal shock testing is performed to determine the ability of parts to function properly in an environment with sudden extreme changes in temperature. It is also used for accelerated testing during product evaluation and qualification process.

Focused ion beam, also known as ion milling, is a technique used particularly in the semiconductor industry and materials science for site-specific analysis, deposition and ablation of materials

The KEMET noise suppression sheets are designed for the high-frequency noise that is generated from the electronic devices

Things are becoming worse since the semiconductor came into a sub-micron and deep sub-micron era. New challenges and 3D PLUS radiation test strategies are presented.

Solutions offered by Alter Technology Laboratories COTS and PEMS Qualification Upscreening / Upgrading Evaluation of New Products EMC Simulation Engineering and Consultancy Environmental Testing Parts Procurement Management Laboratory Services

Fault Injection is an inexpensive technique that during design time, refine the design for the test fixture, improve the quality of stimuli, in order to maximize the error rate, and test the design observability.

The space probe Rosetta was built by the European Space Agency (ESA ) with the objective of reach and study Comet 67P/Churyumov-Gerasimenko. Was launched on March 2004 from Kourou. To place it on the required orbit to rendezvous with Comet 67P/ Churyumov-Gerasimenko it received four gravity assist manoeuvres: 3 from Earth (4 March 2005, 13 November 2007 and 13 November 2009) and 1 from Mars (25 February 2007).

The general specification for hybrid microcircuits (MIL-PRF-38534) details the qualification and testing requirements for non-hermetic packages for military and space applications, and the MIL-PRF-38535 proposed class Y monolithic microcircuits for non-hermetic space level.

Some specific user requirements cannot be fulfilled by QPL parts (scientific missions). In these situations, plastic encapsulated COTSs are investigated. We comply with the applicable specification so that in this case they comply with the applicable specification. If the plastic encapsulated COTS with the required functionality does not meet the rejection criteria of conventional test methods, Alter Technology, with internal criteria for the assessment of plastic encapsulated COTSs, and the final user agree on a set of new rejection criteria for lot acceptance by considering the actual working conditions plus additional validation test flow based on the expected use.

Shipment Hold Notification for all MIl-PRF-39009, VISHAY Style ENH & ERH, Military type RER, Columbus, Nebraska and Juarez, Mexico Manufactured Product.

Stress relaxation: decrease of the contact pressure held between the wires and at the wire-barrel interface, Improper crimping: neither damage the insulation of the wire strands nor to leave insulator residues over the stripped conductor. Diagnosis tools: improper degree of compression and related issues can be detected either