High reliability assembled PCB prototypes as well as novel surface mounted devices (SMD) and mixed systems must be assessed according to well defined qualification test plans. Such high reliability verification programmes are not limited to just evaluate the robustness, reliability and performance of the product but they also address the verification of tools, fabrication procedures and involved materials, as well as the confirmation of product integrity. For instance, ECSS (European Cooperation for Space Standardization” (ECSS) standards used in space programs

Life test is an electrical stress test that typically employs voltage and/or temperature to accelerate the appearance of wear-out reliability failures in a device. The objective of life testing is to evaluate whether failures caused by wear-out are likely to occur during the product lifetime and thus to estimate compliance of the device with the long-term reliability requirements

AVX will cease to manufacture MIL-PRF-55681/4 styles CDR11, CDR12, CDR13, and CDR14 with the BG dielectric. (90 ± 20ppm). AVX will continue to support same styles with BP dielectric (0±30ppm).

Is an electrical stress test that typically employs voltage and/or temperature to accelerate the appearance of latent reliability defects in a device. The objective of burn-in is to eliminate all potential failure likely to occur at the early phase of the product life time (also called Infant Mortality Failure). It can easily be observed in a typical reliability bath tub curve as shown below.

An important starting point must be stressed that NONE OF THE “AS RECEIVED” SMD DEVICES POSSESSED WHISKERS. It was confirmed by performing a visual inspection. This was repeated by the company, with the help of the SEM, on the three lots of devices after each of the four runs for conditions of Temperature Cycling, and the Ambient- and High-Temperature/Humidity Storage.

Additional testing: This deviation is considered as a reliability concern and additional tests must be conducted to check the system performance. From the point of view of the SAM inspection, such deviations do not comply with the acceptance criterion

HAST test reduces the time it takes to complete the typical humidity 85 ºC / 85% RH testing for semiconductors (96 HAST hours are equivalent to 1000 THB hours). By elevating temperatures above 100°C (usually up to 130°C) and increasing the pressure, simulation of normal humidity tests can be made while maintaining the same failure mechanisms.

Tests, inspections or combination thereof, imposed on 100% of parts to remove unsatisfactory items or those likely to exhibit early failures. Using stress testing, defects are weeded out in a product where the root causes cannot be eliminated. Removing all the defective parts (infant mortality) brings the lot to the constant failure rate (working life) phase. The screening does not increase the reliability of the components but removes those showing weakness or defects. Tests, inspections or combination thereof, imposed on 100% of parts to remove unsatisfactory items or those likely to exhibit early failures.

In acoustic microscopy, resolution and inspection depth is an inversely related parameter that depends on the probe frequency and the characteristics of the involved materials. Therefore, the inspection frequency must be carefully selected in order to optimize the accuracy without decreasing the inspection depth below the specimen thickness. Suitable selection of the inspection parameters provides: Detection of ultra-thin (submicrometric) delamination in multilayer systems. Micrometric lateral resolution. In acoustic microscopy, resolution and inspection depth is an inversely related parameter that depends on the probe frequency and the characteristics of the involved materials.

The environmental conditions in the space are extreme, the combination of low pressure and the extreme temperatures can cause the failure of a component. That is why we test the components in similar conditions.

Submicrometric-nanometric objects nowadays present in the design of integrated circuits induce singular heat transport phenomena leading to the formation of hot-spots or strong temperature gradients at specific focal points, which compromises the suitable operation and reliability of microelectronic systems and can potentially decrease the lifetime.

It is important to be vigilant in the procurement of electronics components, particularly for space components, because once launched, they cannot be repaired and many spacecraft have intended lives of 14 years and some like Pioneer will continue communicating with Earth for more than 40 years.