DoEEEt Technical Blog
Keep up with the latest updates about Hi-Rel Components, COTs and much more
Electronic Design Services Depending on Your Technical Requirements
Electronic design services tailored to Power, RF, Digital and FPGA projects, including PCB design, EMC, simulation and high reliability solutions.
What Does the Prototyping Service Cover?
What does the prototyping service cover? Learn how PCB prototyping, assembly, procurement and validation ensure high reliability and risk mitigation.
RF Design for High Reliability Space Applications: Qualification Testing and Risk Mitigation
High reliability RF design for space applications including 56Gbps optical transceivers, FPGA-based real-time systems, controlled impedance PCB layout, radiation qualification testing and industrialization.
Electronic Design Services Depending on Your Technical Requirements
Electronic design services tailored to Power, RF, Digital and FPGA projects, including PCB design, EMC, simulation and high reliability solutions.
What Does the Prototyping Service Cover?
What does the prototyping service cover? Learn how PCB prototyping, assembly, procurement and validation ensure high reliability and risk mitigation.
RF Design for High Reliability Space Applications: Qualification Testing and Risk Mitigation
High reliability RF design for space applications including 56Gbps optical transceivers, FPGA-based real-time systems, controlled impedance PCB layout, radiation qualification testing and industrialization.
Electronic Design Services: From Concept to PCB and Prototype
Electronic Design combines hardware and software engineering to transform requirements into reliable, manufacturable products. Discover the complete process—from system architecture and simulation to PCB layout, prototyping, and qualification testing—optimized for high-performance industries.
Testing prototypes, production boards, and components
Testing prototypes, production boards, and components At ALTER, we offer a comprehensive Electronic Product Testing regarding laboratory tests for complex systems, equipment, and components.
Design Project Management Roles: From RFQ to Delivery in High-Reliability Projects
Design project management in high-reliability space projects requires strict risk mitigation, qualification testing, procurement control, and cross-functional coordination to deliver flight-ready hardware on time and within budget.
Design for Manufacturing (DFM) Based Design for High-Reliability PCB and Electronics Assembly in Space Applications
Design for manufacturing is based on design rules from manufacturing processes for both the PCB and Electronics assemblers. Some authors prefer to have separate definitions for the PCB
COTS devices for Space Missions: Flexible and Cost-Efficient Up-Screening
This webinar explores how Mini-Circuits supports mission-critical aerospace, defense, and space applications through custom high-reliability screening and qualification workflows tailored to customer requirements and Source Control Drawings.
Introduction to Norris-Landzberg equation for thermal cycling test definition
The Norris-Landzberg equation is that it is required by ECSS in many calculations. For example, ECSS-Q-ST-70-61 and several ESA Memos indicate that the use of this equation is mandatory in order to assess if the qualification perform of PBAs covers the environment of the mission. Similar methodologies are widely referenced in MIL and NASA standards
Detection of foreign material and cracks using Scanning Acoustic Microscopy
Scanning Acoustic Microscopy (SAM) enables non-destructive detection of internal cracks and foreign material within microelectronic device encapsulation. This analysis reveals critical defects that compromise mechanical and electrical reliability according to PEM-INST-001.
Pushing Boundaries: Cryogenic Testing Expertise for Space EEE Components at ALTER
ALTER Technology is pushing the limits of space reliability through advanced cryogenic testing of EEE components for ESA’s ARIEL mission. Using state-of-the-art helium cryostats reaching temperatures as low as 10K, ALTER qualifies critical components, from microswitches to operational amplifiers—to ensure flawless performance in extreme thermal environments.
SRT-MICROCÉRAMIQUE – Space-Grade Ceramic Capacitors
SRT-MICROCÉRAMIQUE, a French manufacturer specializing in high-reliability ceramic capacitors, is now fully integrated into doEEEt with its ESCC 3009-Equivalent and COTS+ Class 1 families. With in-house PME manufacturing, extensive testing, and decades of experience in Space, Defence, Medical, and Industrial sectors, SRT-MICROCÉRAMIQUE offers fast, flexible, and robust alternatives to traditional suppliers.
Detecting Delamination in Solder Area
Scanning Acoustic Microscopy (SAM) enables precise detection of critical solder delamination in power modules. This study reveals how internal solder defects exceeding 50% contact loss compromise thermal performance and reliability, as defined by the J-STD-020E standard.
Contain, Correct, Continue: Apogee’s Scalable Approach to Fault Management in Space
Discover how Apogee Semiconductor enhances space mission reliability through radiation-immune products and scalable fault containment architectures — enabling cost-effective, system-level resilience from ground to orbit.
Space Ceramic Capacitors with Flexible Testing : European Supply, Quality You Choose, Smarter Costs
Learn how SRT-Microcéramique develops space-qualified ceramic capacitors screened to ECSS-3009 and AEC-Q200 BME standards. Explore PME and BME technologies, retinning solutions, and fast, flexible sourcing for space applications.
Discover the ALTER EEE parts engineering and Product Assurance capabilities at your service
ALTER EEE and Product Assurance scenario: The team of Senior EEE parts and PA engineers at ALTER will guide and help your team to understand the key drivers for the selection of the most suitable parts for your design, based on the deep knowledge of space market as well as the main standards used in Europe (ECSS-Q-ST-60s), US (NASA GSFC, DLA MIL-PRFs and QPL/QMLs) and commercial market (AEC-Q, …).
C-SAM Analysis in Capacitors: Ensuring Reliability Before Assembly
C-SAM analysis is a non-destructive inspection method used to detect internal defects in capacitors, such as voids, cracks, and delaminations. At Alter Technology, we apply this technique to ensure reliability, prevent premature failures, and guarantee the highest quality before component assembly.
False Delaminations And Adhesions In Acoustic Inspection: Identification, Causes, And Verification Methods
Explore this technical note on how false delaminations and adhesions can significantly impact the reliability of acoustic inspections.
ALTER awarded ESA contract to evaluate non-hermetic optocouplers for high voltage space applications
ALTER TECHNOLOGY secures ESA contract to assess high-voltage non-hermetic optocouplers for next-gen space missions.
C-SAM Inspection Reveals Critical Delamination in Dual Switching Diode
Explore this technical note presenting an Inspection Reveals Critical Delamination in Dual Switching Diode
ISL73141SEH and ISL73148SEH: Radiation-Hardened SAR ADCs for space applications
The ISL73141SEH and ISL73148SEH are radiation-hardened 14-bit ADCs offering precision and reliability for mission-critical systems.
Advantages of a high precision ADC in space applications: The ISL71148 8-Channel SAR ADC
High precision ADC ensures accurate data acquisition and control in radiation-tolerant systems for space applications.
Radiation-Tolerant SAR ADCs in space exploration
Radiation-tolerant SAR ADCs provide precise, low-power signal conversion for resilient space-based data systems.
Renesas’ wafer-by-wafer Low Dose Rate Acceptance testing
Low dose rate acceptance testing ensures ELDRS resilience in space-grade components for long-term mission reliability.
Testing prototypes, production boards, and components
Testing prototypes, production boards, and components At ALTER, we offer a comprehensive Electronic Product Testing regarding laboratory tests for complex systems, equipment, and components.
Design Project Management Roles: From RFQ to Delivery in High-Reliability Projects
Design project management in high-reliability space projects requires strict risk mitigation, qualification testing, procurement control, and cross-functional coordination to deliver flight-ready hardware on time and within budget.
Electronic Design Services Depending on Your Technical Requirements
Electronic design services tailored to Power, RF, Digital and FPGA projects, including PCB design, EMC, simulation and high reliability solutions.
What Does the Prototyping Service Cover?
What does the prototyping service cover? Learn how PCB prototyping, assembly, procurement and validation ensure high reliability and risk mitigation.
RF Design for High Reliability Space Applications: Qualification Testing and Risk Mitigation
High reliability RF design for space applications including 56Gbps optical transceivers, FPGA-based real-time systems, controlled impedance PCB layout, radiation qualification testing and industrialization.
Todos los artículos
Lo último en certificación
Electronic Design Services: From Concept to PCB and Prototype
Electronic Design combines hardware and software engineering to transform requirements into reliable, manufacturable products. Discover the complete process—from system architecture and simulation to PCB layout, prototyping, and qualification testing—optimized for high-performance industries.
Electronic Manufacturing Services (EMS): Design, Assembly & Testing for High-Reliability Applications
The Electronic Manufacturing Services (EMS) market entails design and engineering, electronic assembly, electronic manufacturing, and testing services for electronic components and PCB assemblies.
Testing prototypes, production boards, and components
Testing prototypes, production boards, and components At ALTER, we offer a comprehensive Electronic Product Testing regarding laboratory tests for complex systems, equipment, and components.
Design Project Management Roles: From RFQ to Delivery in High-Reliability Projects
Design project management in high-reliability space projects requires strict risk mitigation, qualification testing, procurement control, and cross-functional coordination to deliver flight-ready hardware on time and within budget.
Design for Manufacturing (DFM) Based Design for High-Reliability PCB and Electronics Assembly in Space Applications
Design for manufacturing is based on design rules from manufacturing processes for both the PCB and Electronics assemblers. Some authors prefer to have separate definitions for the PCB
COTS devices for Space Missions: Flexible and Cost-Efficient Up-Screening
This webinar explores how Mini-Circuits supports mission-critical aerospace, defense, and space applications through custom high-reliability screening and qualification workflows tailored to customer requirements and Source Control Drawings.
Introduction to Norris-Landzberg equation for thermal cycling test definition
The Norris-Landzberg equation is that it is required by ECSS in many calculations. For example, ECSS-Q-ST-70-61 and several ESA Memos indicate that the use of this equation is mandatory in order to assess if the qualification perform of PBAs covers the environment of the mission. Similar methodologies are widely referenced in MIL and NASA standards
Detection of foreign material and cracks using Scanning Acoustic Microscopy
Scanning Acoustic Microscopy (SAM) enables non-destructive detection of internal cracks and foreign material within microelectronic device encapsulation. This analysis reveals critical defects that compromise mechanical and electrical reliability according to PEM-INST-001.
Pushing Boundaries: Cryogenic Testing Expertise for Space EEE Components at ALTER
ALTER Technology is pushing the limits of space reliability through advanced cryogenic testing of EEE components for ESA’s ARIEL mission. Using state-of-the-art helium cryostats reaching temperatures as low as 10K, ALTER qualifies critical components, from microswitches to operational amplifiers—to ensure flawless performance in extreme thermal environments.
SRT-MICROCÉRAMIQUE – Space-Grade Ceramic Capacitors
SRT-MICROCÉRAMIQUE, a French manufacturer specializing in high-reliability ceramic capacitors, is now fully integrated into doEEEt with its ESCC 3009-Equivalent and COTS+ Class 1 families. With in-house PME manufacturing, extensive testing, and decades of experience in Space, Defence, Medical, and Industrial sectors, SRT-MICROCÉRAMIQUE offers fast, flexible, and robust alternatives to traditional suppliers.
Electronic Design Services Depending on Your Technical Requirements
Electronic design services tailored to Power, RF, Digital and FPGA projects, including PCB design, EMC, simulation and high reliability solutions.
What Does the Prototyping Service Cover?
What does the prototyping service cover? Learn how PCB prototyping, assembly, procurement and validation ensure high reliability and risk mitigation.
RF Design for High Reliability Space Applications: Qualification Testing and Risk Mitigation
High reliability RF design for space applications including 56Gbps optical transceivers, FPGA-based real-time systems, controlled impedance PCB layout, radiation qualification testing and industrialization.
Testing prototypes, production boards, and components
Testing prototypes, production boards, and components At ALTER, we offer a comprehensive Electronic Product Testing regarding laboratory tests for complex systems, equipment, and components.
Design Project Management Roles: From RFQ to Delivery in High-Reliability Projects
Design project management in high-reliability space projects requires strict risk mitigation, qualification testing, procurement control, and cross-functional coordination to deliver flight-ready hardware on time and within budget.
Design for Manufacturing (DFM) Based Design for High-Reliability PCB and Electronics Assembly in Space Applications
Design for manufacturing is based on design rules from manufacturing processes for both the PCB and Electronics assemblers. Some authors prefer to have separate definitions for the PCB
COTS devices for Space Missions: Flexible and Cost-Efficient Up-Screening
This webinar explores how Mini-Circuits supports mission-critical aerospace, defense, and space applications through custom high-reliability screening and qualification workflows tailored to customer requirements and Source Control Drawings.
Introduction to Norris-Landzberg equation for thermal cycling test definition
The Norris-Landzberg equation is that it is required by ECSS in many calculations. For example, ECSS-Q-ST-70-61 and several ESA Memos indicate that the use of this equation is mandatory in order to assess if the qualification perform of PBAs covers the environment of the mission. Similar methodologies are widely referenced in MIL and NASA standards
Detection of foreign material and cracks using Scanning Acoustic Microscopy
Scanning Acoustic Microscopy (SAM) enables non-destructive detection of internal cracks and foreign material within microelectronic device encapsulation. This analysis reveals critical defects that compromise mechanical and electrical reliability according to PEM-INST-001.
Pushing Boundaries: Cryogenic Testing Expertise for Space EEE Components at ALTER
ALTER Technology is pushing the limits of space reliability through advanced cryogenic testing of EEE components for ESA’s ARIEL mission. Using state-of-the-art helium cryostats reaching temperatures as low as 10K, ALTER qualifies critical components, from microswitches to operational amplifiers—to ensure flawless performance in extreme thermal environments.
SRT-MICROCÉRAMIQUE – Space-Grade Ceramic Capacitors
SRT-MICROCÉRAMIQUE, a French manufacturer specializing in high-reliability ceramic capacitors, is now fully integrated into doEEEt with its ESCC 3009-Equivalent and COTS+ Class 1 families. With in-house PME manufacturing, extensive testing, and decades of experience in Space, Defence, Medical, and Industrial sectors, SRT-MICROCÉRAMIQUE offers fast, flexible, and robust alternatives to traditional suppliers.
Detecting Delamination in Solder Area
Scanning Acoustic Microscopy (SAM) enables precise detection of critical solder delamination in power modules. This study reveals how internal solder defects exceeding 50% contact loss compromise thermal performance and reliability, as defined by the J-STD-020E standard.
Contain, Correct, Continue: Apogee’s Scalable Approach to Fault Management in Space
Discover how Apogee Semiconductor enhances space mission reliability through radiation-immune products and scalable fault containment architectures — enabling cost-effective, system-level resilience from ground to orbit.