Ultrasonic Examination of Ceramic Capacitors by Scanning Acoustic Microscopy (SAM) has proved to be the most effective tool for the non-destructive detection of very thin (even below 200 nm of thickness) internal anomalies (delamination, voids, cracks, and foreign material) within ceramic capacitors and other EEE parts

The video shows how Kemet’s KC-LINK capacitors are tested for ripple current rating and ESR. These surface mount capacitors are designed to meet the growing demand for fast-switching wide bandgap (WBG) semiconductors that operate at higher voltages, temperatures, and frequencies.

Current limiting is a basic block element of any power supply. Many electronic devices are powered almost 100% of the time and are usually unattended, and therefore safety methods like current limit devices are essential to protect and improve the good performance of the equipment. In this sense, current protection is even more important in space applications, not only because of the criticality of the missions and the unavailability of repair but also because the possibility of Single Event Latch-up

General construction of Tantalum, Aluminum electrolytic, Multi-layer Ceramics, Film, and Super capacitors and Common Mode Choke and Surface Mount inductors are explained.

The procurement, evaluation, screening and lot acceptance of RF devices in leadless SMD packages to be used in spacecraft applications show unexpected difficulties whenever de-golding or retinning processes are required. This is associated to the induced lack of coplanarity in the contacts after those.

In acoustic microscopy, resolution and inspection depth is an inversely related parameter that depends on the probe frequency and the characteristics of the involved materials. Therefore, the inspection frequency must be carefully selected in order to optimize the accuracy without decreasing the inspection depth below the specimen thickness. Suitable selection of the inspection parameters provides: Detection of ultra-thin (submicrometric) delamination in multilayer systems. Micrometric lateral resolution. In acoustic microscopy, resolution and inspection depth is an inversely related parameter that depends on the probe frequency and the characteristics of the involved materials.

There are a multitude of SMD Power Inductors construction types available for the different types of application: Magnetically shielded and Unshielded

Transformers can be used for various tasks: Isolation, Voltage transformation, Current transformation, Impedance matching

This webinar provides an overview of GaN technology in space applications and presents an example of the tests are required for GaN components to be used in an space mission.

Once the EEE parts have successfully passed the required test and controls, can be considered the parts as “Space Qualified” forever?

Internal (invisible) fabrication and materials defects can critically compromise the performance of encapsulated microelectronics parts. Similarly, accidental constructional failures (missing parts) and counterfeit suppose and non-negligible issue in the current EEE market.

The aim of this destructive test is to demonstrate that the internal materials, design, construction, and assembly of EEE parts are in accordance with the applicable acquisition document. This test can also be performed to examine unsealed devices prior to capping to verify that no damage and/or defects have appeared as a result of prior testing (see Pre-cap Inspection).