KEMET METCOM Power Inductors, MPXV Series
Kemet Electronic Corporation

KEMET METCOM Power Inductors, MPXV Series

Kemet Electronic Corporation
September 7, 2020
0
MPXV inductors are available with inductance values to range from 0.10µH to 100µH and with RMS current ratings up to 90A. The inductors are offered in a wide range of SMD case sizes, including small...
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Testing Methods EEE Parts

THE PURCHASING PROCESS OF EEE PARTS

The Purchasing Process of EEE Parts – Key Factors for Success

Paloma Serrano
June 1, 2020
0
The correct assessment and quotation phases followed by the correct part choice and purchase order placement are crucial steps for the successful procurement of EEE parts. However, the next phase of the procurement, the follow-up phase, is just as important to meet the technical requirements and timely delivery that will result in a successful purchase of the wanted parts.
Quality Assurance and Safety at a TID Radiation test laboratory

Quality Assurance and Safety at a TID Radiation test laboratory

doEEEt Media Group
February 13, 2020
0
The Total Ionizing Dose (TID) radiation test on EEE parts involves a number of variables and processes which must be kept under control to ensure correct test execution and compliance with the used test method. From the test plan definition to the test report issue, the proper methodology needs to be put in place.
digging into a circuit VIDEO

Video Digging into Circuit Alter Technology

doEEEt Media Group
June 17, 2019
0
For satellite applications where failure is not an option, electronic components need to operate constantly on demand, and have to be free of failures during the lifetime of the satellite-which can be for many years. To ensure this requirement is met, the components are put through many hours of stress testing covering all thermal.
vibration test flow

Flow Stages in Vibration Testing on Hi-Rel EEE Parts

María Teresa Rodríguez
May 25, 2019
0
Depending on the intended application electrical components are exposed to either transitory or permanent dynamic mechanical stress which can impair the performance (e.g. mechanically induced crack in PCBs systems or fretting corrosion in connectors and others).
Raman Thermometry

Raman Thermometry Technique on Hi-Rel EEE Parts

Francisco Javier Aparicio Rebollo
March 19, 2019
0
As typical length in integrated circuits decreases thermal management is becoming a key factor determining the reliability and lifetime of such systems. Furthermore, micrometric and submicrometric objects in integrated circuits modify local heat transport and may lead to the formation of unintentional hot-spots. Thus, the accurate measurement of the local temperature with micrometric spatial resolution is crucial to confirm the suitable operation of highly integrated systems.
MLCC

How to determine and measure MLCC ripple current and ESR

doEEEt Media Group
December 16, 2019
0
The video shows how Kemet’s KC-LINK capacitors are tested for ripple current rating and ESR. These surface mount capacitors are designed to meet the growing demand for fast-switching wide bandgap (WBG) semiconductors that operate at higher voltages, temperatures, and frequencies.
Optoelectronic Components for Integration into Space

Optoelectronic Components for Integration into Space

doEEEt Media Group
February 13, 2020
0
Spacecraft structural health-monitoring applications are pushed forward by increased constraints in the cost of launching payloads into orbit that dictates major reduction in structural weight only attained through the use of advanced materials and innovative manufacturing methods.
PCB Board Design and Handling

Mounting Guidelines: PCB Board Design and Handling

Tomáš Zedníček
February 27, 2020
1
Board Design and Component Pre-Assembly Preparation The leads of leaded components shall be bent and often cut to the right length before they are mounted/soldered to the substrate. Lead cutting, bending and mounting are operations that may be hazardous if they are not performed properly.

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