Performing an environmental test means subjecting the device or system to certain environmental conditions (cold, dry heat, relative humidity, etc.) in order to check if the operational parameters remain within the range defined by the applicable regulations.

Microsection analysis is performed on an assembled through hole device as a part of a failure analysis. Cross-section through the plane of interest can provide helpfully information about solder defects, PCB inner layers and internal construction. As a part of a failure analysis, the plane of interest has to be selected taking into account PCB characteristic, observed failure and previous test results.

Lead integrity test is performed to determine the integrity of the device leads (terminals), welds and seals. During the execution of this test, the DUT is subjected to various stresses including tension, bending fatigue and torque. The stresses to be applied depend on the DUT characteristics and on the corresponding test method.

Sensing current by measuring voltage across a resistor is simple and elegant, but issues arise with the electrical interface, sizing and selection, and thermal/mechanical considerations

Penetrant dye gross leak test is used to identify leakage pathways within hermetic and non-hermetic devices, such as glass body devices or plastic encapsulated parts. The test provides a definitive view of the leak paths including cracks, voids, delaminations and other fractures.

High-resolution inspection of plastic encapsulated systems with complex internal architectures requires of confocal imaging techniques to block out-of-focus features that otherwise impair the resolution and the image quality.

The Tin Whisker is a conductive hairy-like crystalline structure of tin that grow spontaneously from a tinned surface, usually as a result of the stress of some sort, and maybe long enough to cause a big problem for those applications demanding a high level of reliability.

Product durability and accelerated life cycle testing are all methods of determining the reliability of a product before release. By subjecting the capacitor to elevated conditions far beyond its normal operational ranges, we seek to discover any defects or points of failure to better inform customers about the limitations of the unit.

C-SAM is a reliable and powerful tool for the non-destructive testing of microelectronic parts and base materials. Moreover, it is mandatory for different applications such as those described below for different sectors. In order to provide a fast reply to our customer needs our Virtual Lab platform for Remote Testing grants immediate access to our test results and fast communication with our engineers during and after the test.

Experimental Methods The surface mount device beads under study have two rectangular contacts at opposite sides. With bends of 90 degrees that have an approximately planar surface of 3.048 mm2 each. In order to comply with the standard JESD22-A121, 12 leads on at least 6 components must be examined, with an accumulated lead surface bigger than 75 mm2.

Destructive Physical Analysis DPA is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements.

Additional testing: This deviation is considered as a reliability concern and additional tests must be conducted to check the system performance. From the point of view of the SAM inspection, such deviations do not comply with the acceptance criterion