DoEEEt Technical Blog
Keep up with the latest updates about Hi-Rel Components, COTs and much more
Connectivity for deep space and new space missions, from CAN network transceiver to Ethernet Phy
In this Webinar, Eric TINLOT, Principal Engineer-Product Marketing Aerospace and Defense for EMEA and APAC from
Microchip Technology will be approach for new space parts. Screening and quality grades. Portfolio update.
ARPS10x0A5: Introducing the most compact radiation-hardened smart power switch for spacecraft
Introducing the Apogee Semiconductor ARPS10x0A5, a radiation-hardened power switch family from Apogee engineered to bring deterministic protection,...
Evaluating Delamination Stability in High-Reliability Electronic Devices
Study on delamination stability in high-reliability electronic devices using SEM and C-SAM after temperature cycling. Results show defect propagation under thermomechanical stress and confirm a manufacturing-related root cause affecting device reliability.
Connectivity for deep space and new space missions, from CAN network transceiver to Ethernet Phy
In this Webinar, Eric TINLOT, Principal Engineer-Product Marketing Aerospace and Defense for EMEA and APAC from
Microchip Technology will be approach for new space parts. Screening and quality grades. Portfolio update.
ARPS10x0A5: Introducing the most compact radiation-hardened smart power switch for spacecraft
Introducing the Apogee Semiconductor ARPS10x0A5, a radiation-hardened power switch family from Apogee engineered to bring deterministic protection,...
Evaluating Delamination Stability in High-Reliability Electronic Devices
Study on delamination stability in high-reliability electronic devices using SEM and C-SAM after temperature cycling. Results show defect propagation under thermomechanical stress and confirm a manufacturing-related root cause affecting device reliability.
ESCC Space Splice connectors
Presentation of a unique ESCC 3401 097 qualified splice solution using proven technology of D*MA contacts ESCC 3401 005.
Commercial Space Screening Approach for Agile, High-Reliability Payloads
Discover how CSL and CSH screening flows help enable reliable commercial space electronics while reducing size, weight, cost, and time to deployment for New Space missions.
MLCC Case Sizes: Standards, Selection Criteria and Impact on Electronic Design
MLCC case size affects capacitance, voltage rating, thermal behaviour and reliability in high-reliability electronics.
Ripple Current in Capacitors: Effects on Performance, Lifetime and High-Reliability Design
Ripple current increases capacitor temperature, reducing lifetime and reliability. Learn key design rules for high-reliability electronics.
MLCC Capacitors in High-Reliability Electronics: What Engineers Should Not Overlook
MLCC fundamentals, limitations (DC bias, cracking, aging) and selection criteria for high-reliability electronics, space and automotive applications.
Electron Microscopy for Ensuring the Integrity of Critical Devices
Scanning Electron Microscopy (SEM) plays a critical role in detecting and characterizing microstructural defects in high-reliability electronic devices. While non-destructive inspection techniques such as Scanning Acoustic Microscopy (C-SAM) are widely used for initial screening, their effectiveness can be limited when inspecting devices with complex geometries. This article presents a case study demonstrating how SEM analysis can reveal interfacial delamination that remains undetected during acoustic inspection, highlighting the complementary role of SEM in reliability assessment and failure investigation.
Electronic Design services depending on your technical requirements
Electronic design services tailored to Power, RF, Digital and FPGA projects, including PCB design, EMC, simulation and high reliability solutions.
What Does the Prototyping Service Cover?
What does the prototyping service cover? Learn how PCB prototyping, assembly, procurement and validation ensure high reliability and risk mitigation.
RF Design for High Reliability Space Applications: Qualification Testing and Risk Mitigation
High reliability RF design for space applications including 56Gbps optical transceivers, FPGA-based real-time systems, controlled impedance PCB layout, radiation qualification testing and industrialization.
Electronic Design Services: From Concept to PCB and Prototype
Electronic Design combines hardware and software engineering to transform requirements into reliable, manufacturable products. Discover the complete process—from system architecture and simulation to PCB layout, prototyping, and qualification testing—optimized for high-performance industries.
Electronic Manufacturing Services (EMS): Design, Assembly & Testing for High-Reliability Applications
The Electronic Manufacturing Services (EMS) market entails design and engineering, electronic assembly, electronic manufacturing, and testing services for electronic components and PCB assemblies.
Testing prototypes, production boards, and components
Testing prototypes, production boards, and components At ALTER, we offer a comprehensive Electronic Product Testing regarding laboratory tests for complex systems, equipment, and components.
Design Project Management Roles: From RFQ to Delivery in High-Reliability Projects
Design project management in high-reliability space projects requires strict risk mitigation, qualification testing, procurement control, and cross-functional coordination to deliver flight-ready hardware on time and within budget.
Design for Manufacturing (DFM) Based Design for High-Reliability PCB and Electronics Assembly in Space Applications
Design for manufacturing is based on design rules from manufacturing processes for both the PCB and Electronics assemblers. Some authors prefer to have separate definitions for the PCB
COTS devices for Space Missions: Flexible and Cost-Efficient Up-Screening
This webinar explores how Mini-Circuits supports mission-critical aerospace, defense, and space applications through custom high-reliability screening and qualification workflows tailored to customer requirements and Source Control Drawings.
Introduction to Norris-Landzberg equation for thermal cycling test definition
The Norris-Landzberg equation is that it is required by ECSS in many calculations. For example, ECSS-Q-ST-70-61 and several ESA Memos indicate that the use of this equation is mandatory in order to assess if the qualification perform of PBAs covers the environment of the mission. Similar methodologies are widely referenced in MIL and NASA standards
Detection of foreign material and cracks using Scanning Acoustic Microscopy
Scanning Acoustic Microscopy (SAM) enables non-destructive detection of internal cracks and foreign material within microelectronic device encapsulation. This analysis reveals critical defects that compromise mechanical and electrical reliability according to PEM-INST-001.
Pushing Boundaries: Cryogenic Testing Expertise for Space EEE Components at ALTER
ALTER Technology is pushing the limits of space reliability through advanced cryogenic testing of EEE components for ESA’s ARIEL mission. Using state-of-the-art helium cryostats reaching temperatures as low as 10K, ALTER qualifies critical components, from microswitches to operational amplifiers—to ensure flawless performance in extreme thermal environments.
SRT-MICROCÉRAMIQUE – Space-Grade Ceramic Capacitors
SRT-MICROCÉRAMIQUE, a French manufacturer specializing in high-reliability ceramic capacitors, is now fully integrated into doEEEt with its ESCC 3009-Equivalent and COTS+ Class 1 families. With in-house PME manufacturing, extensive testing, and decades of experience in Space, Defence, Medical, and Industrial sectors, SRT-MICROCÉRAMIQUE offers fast, flexible, and robust alternatives to traditional suppliers.
Detecting Delamination in Solder Area
Scanning Acoustic Microscopy (SAM) enables precise detection of critical solder delamination in power modules. This study reveals how internal solder defects exceeding 50% contact loss compromise thermal performance and reliability, as defined by the J-STD-020E standard.
Contain, Correct, Continue: Apogee’s Scalable Approach to Fault Management in Space
Discover how Apogee Semiconductor enhances space mission reliability through radiation-immune products and scalable fault containment architectures — enabling cost-effective, system-level resilience from ground to orbit.
Commercial Space Screening Approach for Agile, High-Reliability Payloads
Discover how CSL and CSH screening flows help enable reliable commercial space electronics while reducing size, weight, cost, and time to deployment for New Space missions.
MLCC Case Sizes: Standards, Selection Criteria and Impact on Electronic Design
MLCC case size affects capacitance, voltage rating, thermal behaviour and reliability in high-reliability electronics.
Connectivity for deep space and new space missions, from CAN network transceiver to Ethernet Phy
In this Webinar, Eric TINLOT, Principal Engineer-Product Marketing Aerospace and Defense for EMEA and APAC from
Microchip Technology will be approach for new space parts. Screening and quality grades. Portfolio update.
ARPS10x0A5: Introducing the most compact radiation-hardened smart power switch for spacecraft
Introducing the Apogee Semiconductor ARPS10x0A5, a radiation-hardened power switch family from Apogee engineered to bring deterministic protection,...
Evaluating Delamination Stability in High-Reliability Electronic Devices
Study on delamination stability in high-reliability electronic devices using SEM and C-SAM after temperature cycling. Results show defect propagation under thermomechanical stress and confirm a manufacturing-related root cause affecting device reliability.
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ESCC Space Splice connectors
Presentation of a unique ESCC 3401 097 qualified splice solution using proven technology of D*MA contacts ESCC 3401 005.
Radiation Analysis Service for Space Missions
Comprehensive Radiation Analysis for space missions, including TID, TNID, and SEE evaluation. Ensure reliability of EEE components in LEO, MEO, and GEO environments.
Commercial Space Screening Approach for Agile, High-Reliability Payloads
Discover how CSL and CSH screening flows help enable reliable commercial space electronics while reducing size, weight, cost, and time to deployment for New Space missions.
MLCC Case Sizes: Standards, Selection Criteria and Impact on Electronic Design
MLCC case size affects capacitance, voltage rating, thermal behaviour and reliability in high-reliability electronics.
Ripple Current in Capacitors: Effects on Performance, Lifetime and High-Reliability Design
Ripple current increases capacitor temperature, reducing lifetime and reliability. Learn key design rules for high-reliability electronics.
MLCC Capacitors in High-Reliability Electronics: What Engineers Should Not Overlook
MLCC fundamentals, limitations (DC bias, cracking, aging) and selection criteria for high-reliability electronics, space and automotive applications.
Electron Microscopy for Ensuring the Integrity of Critical Devices
Scanning Electron Microscopy (SEM) plays a critical role in detecting and characterizing microstructural defects in high-reliability electronic devices. While non-destructive inspection techniques such as Scanning Acoustic Microscopy (C-SAM) are widely used for initial screening, their effectiveness can be limited when inspecting devices with complex geometries. This article presents a case study demonstrating how SEM analysis can reveal interfacial delamination that remains undetected during acoustic inspection, highlighting the complementary role of SEM in reliability assessment and failure investigation.
Electronic Design services depending on your technical requirements
Electronic design services tailored to Power, RF, Digital and FPGA projects, including PCB design, EMC, simulation and high reliability solutions.
What Does the Prototyping Service Cover?
What does the prototyping service cover? Learn how PCB prototyping, assembly, procurement and validation ensure high reliability and risk mitigation.
RF Design for High Reliability Space Applications: Qualification Testing and Risk Mitigation
High reliability RF design for space applications including 56Gbps optical transceivers, FPGA-based real-time systems, controlled impedance PCB layout, radiation qualification testing and industrialization.
Connectivity for deep space and new space missions, from CAN network transceiver to Ethernet Phy
In this Webinar, Eric TINLOT, Principal Engineer-Product Marketing Aerospace and Defense for EMEA and APAC from
Microchip Technology will be approach for new space parts. Screening and quality grades. Portfolio update.
ARPS10x0A5: Introducing the most compact radiation-hardened smart power switch for spacecraft
Introducing the Apogee Semiconductor ARPS10x0A5, a radiation-hardened power switch family from Apogee engineered to bring deterministic protection,...
Evaluating Delamination Stability in High-Reliability Electronic Devices
Study on delamination stability in high-reliability electronic devices using SEM and C-SAM after temperature cycling. Results show defect propagation under thermomechanical stress and confirm a manufacturing-related root cause affecting device reliability.
Commercial Space Screening Approach for Agile, High-Reliability Payloads
Discover how CSL and CSH screening flows help enable reliable commercial space electronics while reducing size, weight, cost, and time to deployment for New Space missions.
MLCC Case Sizes: Standards, Selection Criteria and Impact on Electronic Design
MLCC case size affects capacitance, voltage rating, thermal behaviour and reliability in high-reliability electronics.
Ripple Current in Capacitors: Effects on Performance, Lifetime and High-Reliability Design
Ripple current increases capacitor temperature, reducing lifetime and reliability. Learn key design rules for high-reliability electronics.
MLCC Capacitors in High-Reliability Electronics: What Engineers Should Not Overlook
MLCC fundamentals, limitations (DC bias, cracking, aging) and selection criteria for high-reliability electronics, space and automotive applications.
Electron Microscopy for Ensuring the Integrity of Critical Devices
Scanning Electron Microscopy (SEM) plays a critical role in detecting and characterizing microstructural defects in high-reliability electronic devices. While non-destructive inspection techniques such as Scanning Acoustic Microscopy (C-SAM) are widely used for initial screening, their effectiveness can be limited when inspecting devices with complex geometries. This article presents a case study demonstrating how SEM analysis can reveal interfacial delamination that remains undetected during acoustic inspection, highlighting the complementary role of SEM in reliability assessment and failure investigation.
Electronic Design services depending on your technical requirements
Electronic design services tailored to Power, RF, Digital and FPGA projects, including PCB design, EMC, simulation and high reliability solutions.
What Does the Prototyping Service Cover?
What does the prototyping service cover? Learn how PCB prototyping, assembly, procurement and validation ensure high reliability and risk mitigation.
RF Design for High Reliability Space Applications: Qualification Testing and Risk Mitigation
High reliability RF design for space applications including 56Gbps optical transceivers, FPGA-based real-time systems, controlled impedance PCB layout, radiation qualification testing and industrialization.
Electronic Design Services: From Concept to PCB and Prototype
Electronic Design combines hardware and software engineering to transform requirements into reliable, manufacturable products. Discover the complete process—from system architecture and simulation to PCB layout, prototyping, and qualification testing—optimized for high-performance industries.
Electronic Manufacturing Services (EMS): Design, Assembly & Testing for High-Reliability Applications
The Electronic Manufacturing Services (EMS) market entails design and engineering, electronic assembly, electronic manufacturing, and testing services for electronic components and PCB assemblies.