This article explores five SRAM memory design approaches for achieving a 16 Mbit memory bank in space systems, comparing traditional...
SRAM design strategies for space systems
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C-SAM
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Comparison of rejection criteria in SAM inspection standards
Comparison of SAM rejection criteria across IPC, ESCC, MIL-STD, and NASA specs for cracks, voids, delamination, and contamination.
Water ingress through delaminated parts in plastic encapsulated systems
Scanning acoustic microscopy (SAM) detects water ingress paths and hidden flaws in delaminated parts of microelectronic systems.
XRF tool for advanced material analysis
XRF tool enables fast, non-destructive analysis of materials in aerospace and electronics for compliance and quality control.
Integrated SAM and stress testing protocols
Combined SAM and stress testing protocols to improve flaw detection and reliability in microelectronic space components.
When to use the Focused Ion Beam (FIB) micro-sectioning technique
Focused ion beam enables precise material removal and analysis in microelectronics and failure investigations.
C-SAM inspection of stacked capacitor lead frames
C-SAM inspection reveals interface anomalies in horizontally stacked capacitors by using high-frequency acoustic imaging.
Inspection of thick plastic encapsulated parts
Thick plastic encapsulated parts require multi-depth confocal imaging to detect delamination, voids, and internal structural defects.
Verifying the structural quality of the glassivation layer
Glassivation layer testing ensures dielectric integrity over aluminum to prevent defects like cracks, pinholes, and electromigration.
Reliability challenges in plastic encapsulated microcircuits
Plastic encapsulated parts pose risks like delamination and voids; SAM detects internal flaws non-destructively with high sensitivity.
SRAM design strategies for space systems
This article explores five SRAM memory design approaches for achieving a 16 Mbit memory bank in space systems, comparing traditional radiation-hardened (rad-hard) SRAM devices with enhanced commercial off-the-shelf (COTS) solutions. The comparison highlights...
Comparison of rejection criteria in SAM inspection standards
Comparison of SAM rejection criteria across IPC, ESCC, MIL-STD, and NASA specs for cracks, voids, delamination, and contamination.
Water ingress through delaminated parts in plastic encapsulated systems
Scanning acoustic microscopy (SAM) detects water ingress paths and hidden flaws in delaminated parts of microelectronic systems.
XRF tool for advanced material analysis
XRF tool enables fast, non-destructive analysis of materials in aerospace and electronics for compliance and quality control.
Integrated SAM and stress testing protocols
Combined SAM and stress testing protocols to improve flaw detection and reliability in microelectronic space components.
When to use the Focused Ion Beam (FIB) micro-sectioning technique
Focused ion beam enables precise material removal and analysis in microelectronics and failure investigations.
C-SAM inspection of stacked capacitor lead frames
C-SAM inspection reveals interface anomalies in horizontally stacked capacitors by using high-frequency acoustic imaging.
Inspection of thick plastic encapsulated parts
Thick plastic encapsulated parts require multi-depth confocal imaging to detect delamination, voids, and internal structural defects.
Verifying the structural quality of the glassivation layer
Glassivation layer testing ensures dielectric integrity over aluminum to prevent defects like cracks, pinholes, and electromigration.
Reliability challenges in plastic encapsulated microcircuits
Plastic encapsulated parts pose risks like delamination and voids; SAM detects internal flaws non-destructively with high sensitivity.