Non-volatile memories retain data without power; endurance and data retention are key for space-grade reliability.
Endurance and data retention in non-volatile memories
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Complying with DPA requirements for space projects
DPA ensures quality and reliability of EEE components by examining design and workmanship through detailed physical analysis.
Lead integrity test methods
Overview of mechanical stress methods for lead integrity test in electronic parts, based on MIL-STD-883 and advanced force/fatigue tools.
When to use the Focused Ion Beam (FIB) micro-sectioning technique
Focused ion beam enables precise material removal and analysis in microelectronics and failure investigations.
Verifying the structural quality of the glassivation layer
Glassivation layer testing ensures dielectric integrity over aluminum to prevent defects like cracks, pinholes, and electromigration.
Looking at device internal structure by a cross-sectioning
Cross-sectioning reveals internal structures and defects in components through precise grinding and polishing.
Identifying leakage pathway with a penetrant dye gross leak test
Leakage pathway detection uses dye tests to reveal cracks or voids compromising device reliability and sealing.
Using a fluorescence microscopy + dye penetrant test on EEE parts
Fluorescence microscopy detects cracks and defects with high sensitivity, enhancing failure analysis in high-reliability electronics.
Fundamentals of solderability and testing methods
Solderability refers to how well a surface can be wetted by solder, assessed through visual or force-based test methods.
MIL-STD-883 2003: Solderability Test procedure
MIL-STD-883 defines solderability testing via Dip and Look to assess termination quality after steam aging and solder dipping.
DPA parts examination: Ensuring quality and reliability in EEE components
DPA parts examination verifies EEE component quality through detailed inspections, detecting defects that could impact system reliability.