Material and Processes Testing

Scanning Electron Microscopy (SEM) plays a critical role in detecting and characterizing microstructural defects in high-reliability electronic devices. While non-destructive inspection techniques such as Scanning Acoustic Microscopy (C-SAM) are widely used for initial screening, their effectiveness can be limited when inspecting devices with complex geometries. This article presents a case study demonstrating how SEM analysis can reveal interfacial delamination that remains undetected during acoustic inspection, highlighting the complementary role of SEM in reliability assessment and failure investigation.

Scanning Acoustic Microscopy (SAM) enables non-destructive detection of internal cracks and foreign material within microelectronic device encapsulation. This analysis reveals critical defects that compromise mechanical and electrical reliability according to PEM-INST-001.

Scanning Acoustic Microscopy (SAM) enables precise detection of critical solder delamination in power modules. This study reveals how internal solder defects exceeding 50% contact loss compromise thermal performance and reliability, as defined by the J-STD-020E standard.

C-SAM analysis is a non-destructive inspection method used to detect internal defects in capacitors, such as voids, cracks, and delaminations. At Alter Technology, we apply this technique to ensure reliability, prevent premature failures, and guarantee the highest quality before component assembly.

Explore this technical note on how false delaminations and adhesions can significantly impact the reliability of acoustic inspections.

Explore this technical note presenting an Inspection Reveals Critical Delamination in Dual Switching Diode