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Scanning Acoustic Microscopy (SAM) enables precise detection of critical solder delamination in power modules. This study reveals how internal solder defects exceeding 50% contact loss compromise thermal performance and reliability, as defined by the J-STD-020E standard.
C-SAM analysis is a non-destructive inspection method used to detect internal defects in capacitors, such as voids, cracks, and delaminations. At Alter Technology, we apply this technique to ensure reliability, prevent premature failures, and guarantee the highest quality before component assembly.
Explore this technical note on how false delaminations and adhesions can significantly impact the reliability of acoustic inspections.
Explore this technical note presenting an Inspection Reveals Critical Delamination in Dual Switching Diode
Comparison of non-destructive test methods like X-ray, SAM, and lock-in IR used to inspect EEE components and detect internal defects.
New space microelectronics benefit from SAM’s non-destructive defect imaging in complex, high-reliability components.
Comparison of SAM rejection criteria across IPC, ESCC, MIL-STD, and NASA specs for cracks, voids, delamination, and contamination.
Scanning acoustic microscopy (SAM) detects water ingress paths and hidden flaws in delaminated parts of microelectronic systems.
Combined SAM and stress testing protocols to improve flaw detection and reliability in microelectronic space components.
C-SAM inspection reveals interface anomalies in horizontally stacked capacitors by using high-frequency acoustic imaging.
Thick plastic encapsulated parts require multi-depth confocal imaging to detect delamination, voids, and internal structural defects.
Plastic encapsulated parts pose risks like delamination and voids; SAM detects internal flaws non-destructively with high sensitivity.
Ultrasonic examination detects submicron internal defects in ceramic capacitors, ensuring reliability through non-destructive analysis.
COTS parts undergo safe C-SAM inspection using deionized water, limited immersion, and drying to prevent corrosion and damage.
C-SAM inspection reveals internal defects like voids and delamination in encapsulated microelectronic components with precision.
C-SAM enables non-destructive inspection of microelectronic parts, detecting internal defects across critical applications.
Scanning Acoustic Microscopy (SAM) enables high-resolution, non-destructive imaging of internal structures and defects in layered systems.
SAM enables non-destructive internal inspection of microelectronic parts by analyzing acoustic wave reflections and contrasts.
Delamination detection using acoustic microscopy reveals internal defects in plastic components, crucial for high-reliability applications.
Delaminations in COTS components can lead to mechanical and electrical failures, making inspection essential for space use.
Scanning Acoustic Microscopy enables reliable crack detection in plastic packages, preventing failures in electronic components.
Explore expert answers on non-destructive inspection techniques for plastic COTS parts using SAM in this Q&A recap.
Non-destructive inspection using acoustic microscopy enhances reliability screening of plastic COTS and electronic systems.
Get expert answers to key questions on CSAM inspections, water use, delamination, and EEE package reliability.
This webinar provides a brief overview of Scanning Acoustic Microscopy and the non-destructive inspection of EEE parts.
The article discusses the application of CSAM in detecting internal defects, such as air gaps and cracks, within high-voltage multilayer ceramic capacitors (MLCCs).