X-ray inspection reveals internal defects in components using non-destructive 2D and 3D imaging techniques.
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X-ray inspection reveals internal defects in components using non-destructive 2D and 3D imaging techniques.
XRF tool enables fast, non-destructive analysis of materials in aerospace and electronics for compliance and quality control.
C-SAM inspection reveals interface anomalies in horizontally stacked capacitors by using high-frequency acoustic imaging.
Thick plastic encapsulated parts require multi-depth confocal imaging to detect delamination, voids, and internal structural defects.
Plastic encapsulated parts pose risks like delamination and voids; SAM detects internal flaws non-destructively with high sensitivity.
COTS parts undergo safe C-SAM inspection using deionized water, limited immersion, and drying to prevent corrosion and damage.
XPS provides precise, non-destructive surface analysis of thin films, revealing elemental composition at nanometer-scale depth.
X-ray fluorescence enables non-destructive measurement of coating thickness with high precision and reliability.
Scanning Acoustic Microscopy enables reliable crack detection in plastic packages, preventing failures in electronic components.