The MLCCs are assembled onto the plates to form the top and bottom EC modules containing five and four MLCCs, respectively. The bottom module has an aluminum plate-fin heat sink at each end to facilitate temperature stability.
Few designs have sufficient volume and sensitivity to circuit size to warrant the shift to integrated passives. It often make sense to trade the PCB space and circuit tolerances against setup costs. As a result, it is no surprise that the market size for integrated passives is dwarfed by that of discretes. Even though they are making inroads, the relative growth of integrated passives is only slightly faster than that of the main market.
Nano Dimension Ltd., a leading additive electronics provider for electronics, announced that it has developed 3D printed capacitors with the Company’s pioneering DragonFly additive manufacturing system. These capacitors are embedded in the body of the additively manufactured printed circuit boards (PCBs), saving space and eliminating the need for assembly.
3rd edition of the PCNS Passive Components Networking Days Symposium is hosted by Department of Chemistry, Materials and Chemical Engineering “Giulio Natta” and Department of Electronics, Information and Bioengineering Faculty of Politecnico di Milano.
The IC industry, following Moore’s Law, has been focusing on the downsizing and the increased density of the integrated transistors, as that has been the main driver for scaling performance. But the electronic circuits need an increasing amount of better passive components within ever-shrinking package sizes.