New space microelectronics benefit from SAM’s non-destructive defect imaging in complex, high-reliability components.
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New space microelectronics benefit from SAM’s non-destructive defect imaging in complex, high-reliability components.
C-SAM inspection reveals interface anomalies in horizontally stacked capacitors by using high-frequency acoustic imaging.
Thick plastic encapsulated parts require multi-depth confocal imaging to detect delamination, voids, and internal structural defects.
Plastic encapsulated parts pose risks like delamination and voids; SAM detects internal flaws non-destructively with high sensitivity.
COTS parts undergo safe C-SAM inspection using deionized water, limited immersion, and drying to prevent corrosion and damage.
Delaminations in COTS components can lead to mechanical and electrical failures, making inspection essential for space use.
Scanning Acoustic Microscopy enables reliable crack detection in plastic packages, preventing failures in electronic components.
Webinar addresses how optoelectronic parameters behave under stress and their suitability for space applications.
Explore expert answers on non-destructive inspection techniques for plastic COTS parts using SAM in this Q&A recap.
Non-destructive inspection using acoustic microscopy enhances reliability screening of plastic COTS and electronic systems.
Testing of optoelectronics in space applications faces challenges from higher power, complex packaging, and limited datasheet specs.
QFN package offers low cost and high performance, but mitigating tin whiskers is crucial for reliability in space applications.
COTS space components offer high performance but require rigorous testing to ensure reliability, traceability, and risk mitigation.
Testing COTS ensures reliability for space applications through assessment, screening, and qualification to mitigate potential risks.