Material analysis identifies elements in microelectronic parts to ensure compliance, reliability, and detection of prohibited materials.
Material analysis techniques for electronic components
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Ultrasonic examination of ceramic capacitors by Scanning Acoustic Microscopy (SAM)
Ultrasonic examination detects submicron internal defects in ceramic capacitors, ensuring reliability through non-destructive analysis.
How to protect your COTS parts during C-SAM inspections
COTS parts undergo safe C-SAM inspection using deionized water, limited immersion, and drying to prevent corrosion and damage.
What is decapsulation of packaged devices?
Decapsulation exposes internal device structures for analysis of die, interconnects, and defects during failure investigations.
Hermeticity testing techniques: seal test, fine & gross leak
Hermeticity testing detects seal integrity in components to prevent contamination and ensure long-term device reliability.
What is a C-SAM Inspection?
C-SAM inspection reveals internal defects like voids and delamination in encapsulated microelectronic components with precision.
How C-SAM ensures reliability in Space, Defense, and Automotive
C-SAM enables non-destructive inspection of microelectronic parts, detecting internal defects across critical applications.
Scanning Acoustic Microscopy (SAM) for deep internal inspection
Scanning Acoustic Microscopy (SAM) enables high-resolution, non-destructive imaging of internal structures and defects in layered systems.
Inside the package: Scanning Acoustic Microscopy (SAM) in EEE inspection
SAM enables non-destructive internal inspection of microelectronic parts by analyzing acoustic wave reflections and contrasts.
Understanding the use of Thermoreflectance Thermal Imaging (TTI)
Thermoreflectance Thermal Imaging (TTI) maps micro-scale temperature gradients in devices with high spatial and temporal resolution.
Material analysis techniques for electronic components
Material analysis identifies elements in microelectronic parts to ensure compliance, reliability, and detection of prohibited materials.
Ultrasonic examination of ceramic capacitors by Scanning Acoustic Microscopy (SAM)
Ultrasonic examination detects submicron internal defects in ceramic capacitors, ensuring reliability through non-destructive analysis.
How to protect your COTS parts during C-SAM inspections
COTS parts undergo safe C-SAM inspection using deionized water, limited immersion, and drying to prevent corrosion and damage.
What is decapsulation of packaged devices?
Decapsulation exposes internal device structures for analysis of die, interconnects, and defects during failure investigations.
Hermeticity testing techniques: seal test, fine & gross leak
Hermeticity testing detects seal integrity in components to prevent contamination and ensure long-term device reliability.
What is a C-SAM Inspection?
C-SAM inspection reveals internal defects like voids and delamination in encapsulated microelectronic components with precision.
How C-SAM ensures reliability in Space, Defense, and Automotive
C-SAM enables non-destructive inspection of microelectronic parts, detecting internal defects across critical applications.
Scanning Acoustic Microscopy (SAM) for deep internal inspection
Scanning Acoustic Microscopy (SAM) enables high-resolution, non-destructive imaging of internal structures and defects in layered systems.
Inside the package: Scanning Acoustic Microscopy (SAM) in EEE inspection
SAM enables non-destructive internal inspection of microelectronic parts by analyzing acoustic wave reflections and contrasts.
Understanding the use of Thermoreflectance Thermal Imaging (TTI)
Thermoreflectance Thermal Imaging (TTI) maps micro-scale temperature gradients in devices with high spatial and temporal resolution.