ALTER Laboratory Services, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Failure Analysis in Electronic Components

Posted by Manuel Padial Pérez
On April 21, 2020
0

Failure analysis is the process of analysing the component data or the component itself to determine the reason(s) for degraded performance or catastrophic failure of a component either, during component manufacturing and testing, during incoming inspection, or after delivery to the customer, at the final application. Since there is an infinite number of variables in play at any one time, it is important as the first step in any failure analysis to understand how and when the failure occurred.

ACTIVES, EEE Components

Analog to digital converters: The resolution dilemma

Posted by José Francisco Largaespada
On April 19, 2020
0

High resolution always pays the penalty of lower sampling rates, which can also derive in a poor representation of the analog signal

PASSIVES

Bypass capacitor S-parameter models: What you need to know

Posted by doEEEt Media Group
On April 9, 2020
0

Whether to think in the time domain or frequency domain, learn how to interpret capacitor manufacturer S-parameter models and how to apply them to your simulations.

EEE Components, PASSIVES, SPECIFICATIONS / QPLs

KEMET SMD BME MLCCs: QPL LISTED PER MIL-PRF-32535

Posted by Kemet Electronic Corporation
On March 19, 2020
0

KEMET MIL-PRF-32535 surface mount capacitors using BME technology,are QPL listed in M and T product levels,getting same Capacitance and Voltage Size than MIL-PRF-123 or MIL-PRF-55681, in Smaller Case

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Voids on sealing area.

Posted by Pedro CARABIAS LÓPEZ
On February 10, 2020
0

Preliminary observation during the External Visual inspection about possible sealing area defects is not enough to confirm the fault. Additional criteria are provided in this post

EEE Components, PASSIVES

Savers for ESCC Circular Connectors 38999 Type

Posted by Manuel Sánchez Ruiz
On January 24, 2020
0

ESCC (European Space Components Coordination) released several Detail Specifications to guide European manufacturers on the manufacture and testing of the different series of MIL-DTL-38999 (series I, series II and series III) for Space applications.

ACTIVES, EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

MICROCHIP FPGAs External Visual Inspection Considerations

Posted by Antonio Rodríguez Arenas
On January 20, 2020
0

One of the quality assurance inspections that are performed in EEE parts is external visual inspection. The applicable method for Microchip FPGAs as well as for other parts with generic specification MIL-PRF-38535, is MIL-STD-883 Method 2009.

ALTER Projects, ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Euclid

Posted by Israel Pedroche
On January 14, 2020
0

The Euclid spacecraft will carry a payload module with a 1.2m-diameter telescope and two state-of-the art scientific instruments: a visible-light camera and a near-infrared camera/spectrometer. Image Credit: Airbus Defence & Space.