EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Platinum Temperature Sensors Solderability Issues

Posted by Manuel Sánchez Ruiz
On May 27, 2022
0

Thermistors or Resistance Temperature Detectors (RTD) using platinum finished leads are widely used in the space market, having provided service to many scientific missions.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Material Analysis Techniques for Electronic Components

Posted by Francisco Javier Aparicio Rebollo
On May 6, 2022
0

Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify potential reliability issues such as undesirable whisker growth caused by pure tin finishes. Lead finish validation for every component type to be soldered is essencial to determine the correct soldering profile.

ENGINEERING AND PROJECT MANAGEMENT SUPPORT

Pre-Procurement

Posted by Susana Galdeano
On May 3, 2022
0

The pre-procurement phase combines the EEE parts state-of-the-art analysis, risk analysis and component ownership cost optimization with regards to the mission requirements, design criticality and budget. In order to achieve this, the project manager leading a multidisciplinary team must find the optimal balance between component information availability (traceability, materials, testing, previous use…) and minimum tests to perform, reaching an acceptable level of reliability covering the technical, schedule and costing constraints.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Thickness Verification. An Introduction on HI-REL

Posted by Emilio Cano García
On April 10, 2022
0

Coating Thickness Verification The thickness of metallic coatings is routinely determined by X-ray fluorescence spectrometry. This provides a basis for assessing the quality of coated materials and therefore influences decisions regarding disposition (acceptability) of the coated product as well as control of coating processes.

ACTIVES, EEE Components, PASSIVES

Space-Qualified Crystals Oscillators from Q-Tech

Posted by doEEEt Media Group
On September 29, 2021
0

Space-Qualified Crystals Oscillators0. The most significant growth in the crowded “Spacescape” is from the emergence of low-earth orbit (LEO) satellites, orbiting from 160 to 2,000 km above the earth’s surface.

ACTIVES, EEE Components

Electronic components for motor vehicles: the solution in New Space?

Posted by Demetrio López
On September 16, 2021
0

There are well-known advantages to using these photonic technologies in space, such as the limited generation of noise, electromagnetic immunity,

SiC Testing

Silicon Carbide Power Diodes

Posted by doEEEt Media Group
On August 12, 2021
0

The Silicon Carbide power diodes were specifically designed for protection of solar cells arrays in solar panels mounted in satellites and space exploration modules. The first batches of devices are currently used for two European Space Agency missions, BepiColombo and Solar Orbiter.

Non-standard testing

Jupiter Icy Moons Explorer (JUICE) Program: Monitoring of JUICE Optical Fibers

Posted by Juan Barbero
On July 5, 2021
0

Monitoring of JUICE Optical Fibers During Thermal Cycles Keeping the Optical Connectors at Different Stable Cryogenic Temperatures in 3-Chambers Setup Two types of multimode fibers (50µm and 400µm) will be used for the scalar sensor of the JUICE (Jupiter Icy Moon Explorer program) magnetometer. This optical sensor will be placed at the end of a boom. These multimode fibers will transmit modulated laser light through the sensor, the light source, and the detector electronics being located within the spaceship.

Optoelectronics Components Testing

Evaluation of Optoelectronics Components for Space Applications

Posted by doEEEt Media Group
On June 10, 2021
0

Solutions offered by Alter Technology Laboratories COTS and PEMS Qualification Upscreening / Upgrading Evaluation of New Products EMC Simulation Engineering and Consultancy Environmental Testing Parts Procurement Management Laboratory Services

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Why Microsectioning sample preparation of PCB systems?

Posted by Mari Carmen López
On May 19, 2021
0

Microsectioning sample preparation is an essential tool for the detailed materialographic inspection of EEE parts, including solder joints on PCB systems involving both surface mounting technology (SMT) and through hole technology (THT). In reveals critical information regarding the structural characteristics and the workmanship quality that is not accessible by other techniques.

Page 1 of 1112 3 ›»