Why Microsectioning sample preparation of PCB systems?

  • Posted by Mari Carmen López
  • On June 19, 2020
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    • 1 likes
Microsectioning sample preparation is an essential tool for the detailed materialographic inspection of EEE parts, including solder joints on PCB systems involving both surface mounting technology (SMT) and through hole technology (THT). In reveals critical information regarding the structural characteristics and the workmanship quality that is not accessible by other techniques.

SEL protection for Space Applications

  • Posted by Sonia Vargas
  • On June 14, 2020
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    • 3 likes
There are several strategies in order to protect circuits from Single Event Latch-Up. Implementing such protection with Current Limiters is a versatile and programmable option. However, this part types must be evaluated under certain stress sources related to space applications, where a set of electrical parameters are measured during the process. Here are presented the typically used ones.

Outgassing and Mating Test

  • Posted by Pedro CARABIAS LÓPEZ
  • On May 6, 2020
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    • 1 likes
ALTER performed Outgassing and Mating Test on High Voltage Connectors with the aim to ensure the proper parts reliability during Solar Orbiter ESA/NASA Mission

Factors for selecting an OpAmp for Space Applications

  • Posted by Manuel Sánchez Ruiz
  • On April 20, 2020
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    • 0 likes
Operational Amplifiers (OpAmp) are widely used components on any electronic equipment nowadays, and of course, this includes Space applications. However, the particularities of this business make that not any component is suitable for this market segment.

Quality Issues in the procurement of Operational Amplifiers

  • Posted by Antonio Rodríguez Arenas
  • On April 20, 2020
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    • 1 likes
The Quality Assurance in EEE parts is a major aspect to take care in the procurement for EEE parts. One family of EEE parts widely used are the Operational Amplifiers which are in much different equipment’s of satellites electronics

EEE Parts Solderability Testing

  • Posted by Manuel Padial Pérez
  • On March 28, 2020
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    • 2 likes
Solderability testing refers to the process of evaluating the solderability of terminations (i.e., component leads, lugs, terminals, wires, etc.). which are normally joined by a soldering operation. The solderability determination is based on the ability of the terminations to be wetted by the molten solder after accelerated aging.
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