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Why do a Residual Gas Analysis?

  • Posted by Dimas Morilla
  • On August 28, 2020
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Residual Gas Analysis, also known as Internal Gas Analysis (IGA), is a destructive test which is performed to examine the atmosphere inside hermetically sealed devices. The test procedure is based on milling the component so that the gas content can be extracted and subsequently analyzed. The measurement of the moisture content is of particular interest as it allows to determine whether the moisture criteria are met. Also, the measurement of all the other gases might be of interest as the gas content reflects upon the quality of the sealing process and can cause long term reliability problems such as corrosion, fogging, leakage, etc.
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What is COTS in the space industry?

  • Posted by doEEEt Media Group
  • On August 11, 2020
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    • 2 likes
The drive to use COTS (Commercial Off-The-Shelf) components in the space industry is growing since these parts allow to obtain higher performance at the system level, which is difficult to obtain using currently available space components. However, the use of COTS components has an inherent risk because of the lack of confidence in the traceability and the long-term performance of these parts as well as the new concerns affecting mostly this type of products (RoHS, counterfeit parts, long-term reliability, etc.).
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Experiments done in Tin Whiskers Growth

  • Posted by Dimas Morilla
  • On July 30, 2020
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    • 2 likes
Experimental Methods The surface mount device beads under study have two rectangular contacts at opposite sides. With bends of 90 degrees that have an approximately planar surface of 3.048 mm2 each. In order to comply with the standard JESD22-A121, 12 leads on at least 6 components must be examined, with an accumulated lead surface bigger than 75 mm2.
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Evaluation of PCB in Alter Technology Lab.

  • Posted by Mari Carmen López
  • On July 25, 2020
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    • 1 likes
The separation of the interest area has to be performed in such a way as to prevent any damage by deformation or input of heat. After cleaning, the specimen is encapsulated before the grinding process takes place.
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Evaluation of Electronic Assemblies

  • Posted by Mari Carmen López
  • On July 18, 2020
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    • 2 likes
Assembly process of THT or SMT onto PCBs for spacecraft applications follow well-established design requirements based on specifications prepared by ECSS (ECSS-Q-ST-70-08C & ECSS-Q-ST-70-38C), NASA and IPC (IPC-6012).
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Why Microsectioning sample preparation of PCB systems?

  • Posted by Mari Carmen López
  • On June 19, 2020
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    • 1 likes
Microsectioning sample preparation is an essential tool for the detailed materialographic inspection of EEE parts, including solder joints on PCB systems involving both surface mounting technology (SMT) and through hole technology (THT). In reveals critical information regarding the structural characteristics and the workmanship quality that is not accessible by other techniques.
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SEL protection for Space Applications

  • Posted by Sonia Vargas
  • On June 14, 2020
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    • 3 likes
There are several strategies in order to protect circuits from Single Event Latch-Up. Implementing such protection with Current Limiters is a versatile and programmable option. However, this part types must be evaluated under certain stress sources related to space applications, where a set of electrical parameters are measured during the process. Here are presented the typically used ones.
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