Why Resistance Noise
- Posted by doEEEt Media Group
- On August 13, 2019
- 0
Noise is an unwanted phenomenon for resistors. For some applications the noise properties are important, discover here why.
Tantalum Capacitors in Space Applications
- Posted by doEEEt Media Group
- On July 31, 2019
- 0
Only tantalum capacitors with established reliability are recommended for the space application. Commercial parts can vary materials and processes, increasing risk of failure in space application.
Need a 3D Characterization Testing? Use Scanning Microscopy CLSM
- Posted by Fernando Teberio
- On July 2, 2019
- 0
Modern manufacturing techniques depend on 3D measurement data combined with CAD/CAM techniques for quality control of high-precision components or mass production. Typically, contact measurement has been widely utilized by the industry. However, for complex and small 3D structures, the application of contact measurement is cumbersome or sometimes impossible. Therefore, noncontact measurement has gradually received much attention from researchers and industry.
Evaluation of PCB in Alter Technology Lab.
- Posted by Mari Carmen López
- On June 25, 2019
- 0
The separation of the interest area has to be performed in such a way as to prevent any damage by deformation or input of heat. After cleaning, the specimen is encapsulated before the grinding process takes place.
Evaluation of Electronic Assemblies
- Posted by Mari Carmen López
- On June 18, 2019
- 0
Assembly process of THT or SMT onto PCBs for spacecraft applications follow well-established design requirements based on specifications prepared by ECSS (ECSS-Q-ST-70-08C & ECSS-Q-ST-70-38C), NASA and IPC (IPC-6012).
EEE Parts Solderability Testing
- Posted by Manuel Padial Pérez
- On May 28, 2019
- 0
Solderability testing refers to the process of evaluating the solderability of terminations (i.e., component leads, lugs, terminals, wires, etc.). which are normally joined by a soldering operation. The solderability determination is based on the ability of the terminations to be wetted by the molten solder after accelerated aging.
MIL-STD-883 METHOD 2003 – Solderability Testing
- Posted by Manuel Padial Pérez
- On May 28, 2019
- 0
The Mil-Std-883 Method 2003 Is One Of The Oldest And Most Widely Used Standards For Solderability Testing.
Platinum Temperature Sensors Solderability Issues
- Posted by Manuel Sánchez Ruiz
- On May 27, 2019
- 0
Thermistors or Resistance Temperature Detectors (RTD) using platinum finished leads are widely used in the space market, having provided service to many scientific missions.
Flow Stages in Vibration Testing on Hi-Rel EEE Parts
- Posted by María Teresa Rodríguez
- On May 25, 2019
- 0
Depending on the intended application electrical components are exposed to either transitory or permanent dynamic mechanical stress which can impair the performance (e.g. mechanically induced crack in PCBs systems or fretting corrosion in connectors and others).
How can failures in vibration tests be avoided?
- Posted by María Teresa Rodríguez
- On May 16, 2019
- 0
As it has been mentioned in “Vibration Test on Hi-Rel for EEE Parts”, vibration tests are important to check the reliability of the components/assemblies. These tests can be a headache and suppose a great cost if the design of the device and the fixing tool are not properly done. Simulation tools are the key to anticipate to the problems reducing costs and lead times.