Scanning Acoustic Microscopy (SAM) and X-Ray Tomography

Posted by doEEEt Media Group
On April 26, 2022
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The Scanning Acoustic Microscopy (SAM) technique is the most effective and complete non-destructive approach for the detection of critical and latent anomalies within plastic encapsulated parts, either on assembled or non-assembled systems

ALTER Laboratory Services, INSPECTION, ELECTRICAL & VERIFICATION

Frequently Asked Questions (FAQs) – Scanning Acoustic Microscopy

Posted by doEEEt Media Group
On February 23, 2022
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Over the years, our experience in CSAM testing has allowed us, among other things, to have conversations with clients who have come to us with questions about our laboratory services. In ALTER, we are an expert and reliable supplier in the engineering and testing EEE components and equipment for space and other technology markets. This article reports the importance of X-Ray Tomography, Scanning Acoustic Microscopy (SAM), and Cross Section techniques, and the advantages of their combined use for accurate testing.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

SAM: Survey to manufacturers and users

Posted by Francisco Javier Aparicio Rebollo
On February 17, 2022
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Do you perform/consider the initial qualification and/or periodic production validation with C-SAM (or other SAM tests)? What acceptance or reject criteria do you use for C-SAM (or other SAM tests)?

ALTER Laboratory Services, Plastic Packaging for Space

Test combination for detecting defects in plastic ICs

Posted by doEEEt Media Group
On February 10, 2022
0

Importance Of Combining X-Ray Tomography, Scanning Acoustic Microscopy (SAM), And Cross Section Techniques For Electronic Components Inspections This article reports the importance of X-Ray Tomography, Scanning Acoustic Microscopy (SAM), and Cross Section techniques, and the advantages of their combined use for accurate testing.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

What is a C-SAM Inspection?

Posted by Francisco Javier Aparicio Rebollo
On January 29, 2022
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Internal (invisible) fabrication and materials defects can critically compromise the performance of encapsulated microelectronics parts. Similarly, accidental constructional failures (missing parts) and counterfeit suppose and non-negligible issue in the current EEE market.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Scanning Microscopy Equipment our new adquisition

Posted by Francisco Javier Aparicio Rebollo
On December 13, 2021
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ALTER TECHNOLGY upgrades its Scanning Acoustic Microscopy capabilities. Alter Technology has upgraded its Scanning Acoustic Microscopy capabilities by acquiring a new FineSAT V acoustic microscope from Hitachi. FineSAT V, the high-end model of the FineSAT series, combines advanced inspection features with the faster inspection speed currently available in the market.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Industry Applications where C-SAM is used

Posted by Francisco Javier Aparicio Rebollo
On November 29, 2021
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C-SAM is a reliable and powerful tool for the non-destructive testing of microelectronic parts and base materials. Moreover, it is mandatory for different applications such as those described below for different sectors. In order to provide a fast reply to our customer needs our Virtual Lab platform for Remote Testing grants immediate access to our test results and fast communication with our engineers during and after the test.

ACTIVES, C-SAM - Short Technical Notes, EEE Components, TESTING

Thermo-mechanical Analyser – TMA – capabilities

Posted by Raquel Cano Cordero
On October 5, 2021
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The thermomechanical analysis (TMA) of plastic encapsulated microelectronic and COTS parts is a fundamental technique to avoid (during the design and fabrication stage) and foresee anomalies related to the deformation of packages with temperature. Thus, this is a very effective tool to disclose and screen out possible reliability concerns related to the thermo-mechanical integrity and stability of the devices.

ALTER Laboratory Services, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Thermo-Mechanical Analysis

Posted by Raquel Cano Cordero
On August 9, 2021
0

The thermomechanical analysis (TMA) of plastic encapsulated microelectronic, and COTS parts is a fundamental technique to avoid (during the design and fabrication stage) and foresee anomalies related to the deformation of packages with temperature. Thus, this is a very effective tool to disclose and screen out possible reliability concerns related to the thermo-mechanical integrity and stability of the devices.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Radiographic X-Ray Inspection

Posted by doEEEt Media Group
On July 2, 2021
0

The purpose of a Radiographic Inspection is to nondestructively detect defects that are not otherwise visible: improper positioning of parts, broken elements, inhomogeneities in materials, foreign objects…

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