SAM: Non-destructive inspection of plastic COTS parts and beyond

Posted by doEEEt Media Group
On June 14, 2021
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The present communication reports about i) the suitability of advanced acoustic microscopy techniques for the screening of plastic COTS devices susceptible to experience catastrophic failures and ii) the applicability of this technique in the inspection and failure analysis of systems besides COTS such as PCBs, metallic assemblies, hermetic packages, electronic potting, RF devices, and others

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Quality Issues in the procurement of Operational Amplifiers

Posted by Antonio Rodríguez Arenas
On April 20, 2021
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The Quality Assurance in EEE parts is a major aspect to take care in the procurement for EEE parts. One family of EEE parts widely used are the Operational Amplifiers which are in much different equipment’s of satellites electronics

C-SAM - Short Technical Notes, EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, TESTING

Non-Destructive Detection of Delaminations in PCBs Assemblies

Posted by Raquel Cano Cordero
On March 10, 2021
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Scanning Acoustic Microscopy (C-SAM) inspection has been used for the comprehensive inspection of the lead-frame in a horizontally stacked capacitor. This non-destructive inspection reveals minor anomalies at the interface with capacitor terminals which may impair the electrical response.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

SAM Capabilities, Analyse the internal structure in EEE Parts

Posted by Francisco Javier Aparicio Rebollo
On February 24, 2021
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In acoustic microscopy, resolution and inspection depth is an inversely related parameter that depends on the probe frequency and the characteristics of the involved materials. Therefore, the inspection frequency must be carefully selected in order to optimize the accuracy without decreasing the inspection depth below the specimen thickness. Suitable selection of the inspection parameters provides: Detection of ultra-thin (submicrometric) delamination in multilayer systems. Micrometric lateral resolution. In acoustic microscopy, resolution and inspection depth is an inversely related parameter that depends on the probe frequency and the characteristics of the involved materials.

Plastic Packaging for Space

OpAmps in Plastic Packages

Posted by Francisco Javier Aparicio Rebollo
On December 17, 2020
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Plastic encapsulated Op-amps are very popular due to the high availability and the diverse applications where they are implemented to. Nevertheless, they suffer from different risks being interfacial delamination and die attach anomalies the most critical ones. Scanning Acoustic inspection is the most suitable tool to avoid and...

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

SAM, the preferred method for the non-destructive internal inspection

Posted by doEEEt Media Group
On December 16, 2020
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SAM, The Preferred Method For The Non-Destructive Internal Inspection. Scanning Acoustic Microscopy of COTS and plastic encapsulated microelectronics. Confocal Scanning Acoustic Microscopy (C-SAM) has proved to be the most effective non-destructive approach for the screening of COTS parts and the detection of latent internal anomalies in PEMs, either before soldering or for assembled systems.

ACTIVES, COTS, New Space, LEO Constellations, EEE Components

Renesas-INTERSIL: Radiation Tolerant Plastic Products

Posted by Manuel Padial Pérez
On November 25, 2020
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The family of products ISL71xxx radiation-tolerant plastic-package ICs enable cost effective solutions for short duration low Earth orbit (LEO) mission profiles.

ACTIVES, COTS, New Space, LEO Constellations, EEE Components

TEXAS INSTRUMENTS: Space Enhanced products (SEP)

Posted by Manuel Padial Pérez
On November 25, 2020
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Space Enhanced Plastic Products (SEP) devices developed to address, among others, New Space applications, offer the following advantages over standard catalog products

INSPECTION, ELECTRICAL & VERIFICATION, Plastic Packaging for Space

SAM: Main Issues in Plastic Encapsulated Systems

Posted by Francisco Javier Aparicio Rebollo
On November 17, 2020
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Plastic Encapsulated COTS offers Lower procurement cost, Shorter procurement time, More performance and functionality available nad Reduced size and weight. An inherent risk of PEMs is related to Lack of hermeticity, The mismatch with the thermomechanical properties of the inorganic internal part and Plastic Encapsulated COTS

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

SAM: Test flow and procedures

Posted by Francisco Javier Aparicio Rebollo
On September 17, 2020
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Nowadays scanning acoustic microscopy (SAM) is extensively used in the non-destructive inspection of microelectronic devices and is present in different space verification programs; particularly for plastic-encapsulated electronic components. This is so due to the ability to image the internal morphology, location, size and distribution of hidden features including different types of flaws.

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