Micrometric-wide internal features of sub-micrometric thickness can be easily detected in our recently upgraded instrument. The high lateral resolution is within the current state of the start in the non-destructive inspection of deeply embedded objects.
BGA device assembled to a PCB has been submitted to the ECSS verification programme following the guideline defined in the ECSS standard ECSS-Q-ST-70-38C. Metallographic analysis allows us to check the status of such devices after performing the environmental tests (Vibration & Thermal Cycling).
High-current low dropout regulator encapsulated in a TO-263 package is inspected by scanning acoustic microscopy. Probe frequency and inspection procedure is adapted to system characteristics. In this case the architecture of the system includes features at different depths within a thick package.
An Infra-red led emitter is inspected by scanning acoustic microscopy. Probe frequency is adapted to the characteristics of the system. In this case, considering the large thickness of the package a 50 MHz transducer is used. Our phase inversion algorithm identifies and highlights the delaminated areas. In addition, A-scan inspection is used to confirm these findings.
High-resolution inspection of plastic encapsulated systems with complex internal architectures requires of confocal imaging techniques to block out-of-focus features that otherwise impair the resolution and the image quality.
Among the test flow where SAM microscopy is used, other tests are carried out in which Alter Technology also has extensive experience, giving its customers the possibility of doing all the necessary tests with our expert engineers, offering support and follow-up at all times thanks to Virtual Lab; where immediate access is generated and in real time to all the information on the parts examined.
Scanning Acoustic Microscopy Service
A-scan, B-scan, C-scan, and Through-scan
Circuit, non-circuit, and through-transmitted signal are systematically inspected at different focal depths
Delamination (phase inversions) is confirmed by A-scan mode
Some specific user requirements cannot be fulfilled by QPL parts (scientific missions).
In these situations, plastic encapsulated COTSs are investigated. We comply with the applicable specification so that in this case they comply with the applicable specification.
If the plastic encapsulated COTS with the required functionality does not meet the rejection criteria of conventional test methods, Alter Technology, with internal criteria for the assessment of plastic encapsulated COTSs, and the final user agree on a set of new rejection criteria for lot acceptance by considering the actual working conditions plus additional validation test flow based on the expected use.
Additional testing: This deviation is considered as a reliability concern and additional tests must be conducted to check the system performance. From the point of view of the SAM inspection, such deviations do not comply with the acceptance criterion