INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Material Analysis Techniques for Electronic Components

Posted by Francisco Javier Aparicio Rebollo
On May 6, 2022
0

Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify potential reliability issues such as undesirable whisker growth caused by pure tin finishes. Lead finish validation for every component type to be soldered is essencial to determine the correct soldering profile.

ACTIVES, EEE Components

Electronic components for motor vehicles: the solution in New Space?

Posted by Demetrio López
On September 16, 2021
0

There are well-known advantages to using these photonic technologies in space, such as the limited generation of noise, electromagnetic immunity,

SiC Testing

Silicon Carbide Power Diodes

Posted by doEEEt Media Group
On August 12, 2021
0

The Silicon Carbide power diodes were specifically designed for protection of solar cells arrays in solar panels mounted in satellites and space exploration modules. The first batches of devices are currently used for two European Space Agency missions, BepiColombo and Solar Orbiter.

ACTIVES, EEE Components, MANUFACTURER NOTIFICATION

Microchip’s Low-Power Radiation-Tolerant (RT) PolarFire® FPGA Enables High-Bandwidth Space Systems with Lower Total System Cost

Posted by Microchip Technology
On July 18, 2021
0

Developers of spacecraft electronics use radiation-tolerant (RT) field programmable gate arrays (FPGAs) to create on-board systems that meet the demanding performance needs of future space missions, survive the brutal launch process and continue to operate reliably in the harsh environment of space

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Press-Fit connectors qualification for space

Posted by Francisco Javier Aparicio Rebollo
On May 15, 2021
0

The burgeoning demand for the incorporation of disruptive technologies into space industry clearly requires fast and reliable procedures for the space qualification of these innovative components.

EEE Components, ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Supercapacitors for Space, Qualification of COTS

Posted by doEEEt Media Group
On April 29, 2021
0

Supercapacitors also called electrochemical double layer capacitors are energy storage devices storing a high volume of electric energy in the double layer between a high surface area electrode and an electrolyte. As compared to batteries no chemical reactions should occur at the electrodes.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Quality Issues in the procurement of Operational Amplifiers

Posted by Antonio Rodríguez Arenas
On April 20, 2021
0

The Quality Assurance in EEE parts is a major aspect to take care in the procurement for EEE parts. One family of EEE parts widely used are the Operational Amplifiers which are in much different equipment’s of satellites electronics

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Phases for Receiving Inspection on Hi-Rel EEE Parts

Posted by Javier Alejandro de la Ossa Fernández
On March 28, 2021
0

Receiving Inspection is an acceptable activity aimed at confirming that the components received are in accordance with the requirements of the applicable purchase order. Our inspectors in Alter Technology Group, verify all raw materials by reconciling the purchase order requirements with the packing slip provided by the supplier in terms of: Parts identification (marking) Quantity verification Packing checking Date code or special restrictions Documentation review, especially the manufacturer’s Certificate of Compliance

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Why do a PIND test – Particle Impact Noise Detection

Posted by Adrián Cembrano Pérez
On March 11, 2021
0

PIND ( Particle Impact Noise Detection Test ) testing is performed in order to detect the presence of loose particles inside a device cavity. Loose particle contamination is often caused by dirt, fibers, solder residues and other elements trapped inside the cavity during the sealing process. Loose particles can be a cause of electrical anomalies (or other physical problems) which in their turn can cause abnormal functioning of the parts and affect their reliability.

EEE Components, PASSIVES

Passive components leadtime reduction

Posted by doEEEt Media Group
On January 6, 2021
0

Many passive components suppliers are lowering quarterly forecasts, one effect of slowing sales has been an easing of severe shortages. for many passive components.

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