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    • INDUSTRY 4.0 CYBERSECURITY (IEC 62443)
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INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Radiographic X-Ray Inspection

  • Posted by doEEEt Media Group
  • On July 2, 2021
  • 0
The purpose of a Radiographic Inspection is to nondestructively detect defects that are not otherwise visible: improper positioning of parts, broken elements, inhomogeneities in materials, foreign objects…
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Small Sats Testing

Component Testing for New Space Applications

  • Posted by Enrique Cordero
  • On July 2, 2021
  • 0
This standard describes the differences and the minimum testing requirements necessary to each of these three classes for evaluation, screening, and lot acceptance. The following test sequence shows the evaluation test sequence for class 1 components, this sequence is the same in the three classes described in the standard with different severity and test conditions to each class.
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ACTIVES, COTS, New Space, LEO Constellations, EEE Components

AXTAL: “Space-COTS Crystals” (SCC)

  • Posted by Manuel Padial Pérez
  • On June 25, 2021
  • 2
For New Space applications AXTAL offers as special service the sourcing and/or up-screening of commercial quartz crystal units with proven quality level to so-called "Space-COTS Crystals" (SCC) increasing the range of available package styles
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INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

What is Decapsulation of packaged devices?

  • Posted by Francisco Javier Aparicio Rebollo
  • On December 20, 2020
  • 0
Decapsulation of packaged devices exposes the internal elements of the device under test. Opening devices by this method allows the inspection of the die, interconnects and other features typically examined during failure analysis (FA), constructional analysis (CA) and destructive physical analysis (DPA).
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INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Scanning Electron Microscope – SEM/FIM – Inspections

  • Posted by Francisco Javier Aparicio Rebollo
  • On December 14, 2020
  • 0
SEM available high magnification tool to analyze the design, construction or handling defects. It can be used to check the interconnect metallization on an integrated circuit: metal step coverage, etc., or for performing an in-depth technology study: reverse engineering, die cross sectioning, failure analysis, etc.
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ACTIVES, COTS, New Space, LEO Constellations, EEE Components

TEXAS INSTRUMENTS: Space Enhanced products (SEP)

  • Posted by Manuel Padial Pérez
  • On November 25, 2020
  • 0
Space Enhanced Plastic Products (SEP) devices developed to address, among others, New Space applications, offer the following advantages over standard catalog products
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INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Radiographic Inspection 3D X-Ray – 2D

  • Posted by José Cándido Vázquez Cárdeno
  • On September 14, 2020
  • 0
The purpose of radiographic inspection is to detect internal physical defects which are not otherwise visible in electronic components. The radiographic techniques reveal such flaws as the presence of foreign objects, improper interconnecting wires, inhomogeneities in materials, improper positioning of elements, voids in the die attach material or encapsulating, etc.
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ABC of CLR, EEE Components, PASSIVES

Introduction to Ceramic Capacitors

  • Posted by doEEEt Media Group
  • On July 1, 2020
  • 0
Within the electrostatic capacitor family we can distinguish two groups: the organic film capacitors and capacitors with inorganic dielectrics. Capacitors with ceramic materials belong to inorganic dielectrics family
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EEE Components, PASSIVES

Ohmcraft High-Voltage Resistors Support Accuracy and Reliability

  • Posted by doEEEt Media Group
  • On June 26, 2020
  • 0
Ohmcraft's precision resistors ensure accurate high voltage in X-ray sources, crucial for medical, industrial, and scientific applications.
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ACTIVES, EEE Components

Quality/reliability issues and detection on High Reliability Optocouplers

  • Posted by Pedro CARABIAS LÓPEZ
  • On April 29, 2020
  • 0
In this post are depicted some non-destructive technics to detect a potential quality/reliability issue on a EEE component and some others destructive to confirm and asses the preliminary findings
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