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C-SAM - Short Technical Notes, EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, TESTING

Non-Destructive Detection of Delaminations in PCBs Assemblies

  • Posted by Raquel Cano Cordero
  • On March 10, 2021
  • 0
Scanning Acoustic Microscopy (C-SAM) inspection has been used for the comprehensive inspection of the lead-frame in a horizontally stacked capacitor. This non-destructive inspection reveals minor anomalies at the interface with capacitor terminals which may impair the electrical response.
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Plastic Packaging for Space

OpAmps in Plastic Packages

  • Posted by Francisco Javier Aparicio Rebollo
  • On December 17, 2020
  • 0

Plastic encapsulated Op-amps are very popular due to the high availability and the diverse applications where they are implemented to. Nevertheless, they suffer from different risks being interfacial delamination and die attach anomalies the most critical ones. Scanning Acoustic inspection is the most suitable tool to avoid and...

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INSPECTION, ELECTRICAL & VERIFICATION, TESTING

SAM, the preferred method for the non-destructive internal inspection

  • Posted by doEEEt Media Group
  • On December 16, 2020
  • 0
SAM, The Preferred Method For The Non-Destructive Internal Inspection. Scanning Acoustic Microscopy of COTS and plastic encapsulated microelectronics. Confocal Scanning Acoustic Microscopy (C-SAM) has proved to be the most effective non-destructive approach for the screening of COTS parts and the detection of latent internal anomalies in PEMs, either before soldering or for assembled systems.
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INSPECTION, ELECTRICAL & VERIFICATION, TESTING

C-SAM Questions & Answers

  • Posted by Francisco Javier Aparicio Rebollo
  • On July 7, 2020
  • 0
In this post, you can read all the questions launched by the attendees, as well as all the answers offered by the speaker.
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INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Non-destructive internal inspection of EEE parts and passive components

  • Posted by Francisco Javier Aparicio Rebollo
  • On July 7, 2020
  • 0
Non-destructive testing methods are critical for the screening, inspection and failure analysis of plastic encapsulated and other EEE systems.
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C-SAM - Short Technical Notes, EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, TESTING

Scanning Acoustic Microscopy (C-SAM) of in Stacked Capacitors

  • Posted by Francisco Javier Aparicio Rebollo
  • On June 12, 2020
  • 0
Scanning Acoustic Microscopy (C-SAM) inspection has been used for the comprehensive inspection of the lead-frame in a horizontally stacked capacitor. This non-destructive inspection reveals minor anomalies at the interface with capacitor terminals which may impair the electrical response.
Read More
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C-SAM - Short Technical Notes, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Ultrasonic Examination of Ceramic Capacitors by Scanning Acoustic Microscopy

  • Posted by Francisco Javier Aparicio Rebollo
  • On May 18, 2020
  • 0
Ultrasonic Examination of Ceramic Capacitors by Scanning Acoustic Microscopy (SAM) has proved to be the most effective tool for the non-destructive detection of very thin (even below 200 nm of thickness) internal anomalies (delamination, voids, cracks, and foreign material) within ceramic capacitors and other EEE parts
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EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, SPECIFICATIONS / QPLs, TESTING

Cracking Problems in Low-Voltage Chip Ceramic Capacitors

  • Posted by doEEEt Media Group
  • On October 14, 2019
  • 0
Guidelines for Selection of Ceramic Capacitors for Space Applications: Cracking Problems in Low-Voltage Chip Ceramic Capacitors
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