SAM, the preferred method for the non-destructive internal inspection

Posted by doEEEt Media Group
On December 16, 2020
0

SAM, The Preferred Method For The Non-Destructive Internal Inspection. Scanning Acoustic Microscopy of COTS and plastic encapsulated microelectronics. Confocal Scanning Acoustic Microscopy (C-SAM) has proved to be the most effective non-destructive approach for the screening of COTS parts and the detection of latent internal anomalies in PEMs, either before soldering or for assembled systems.

C-SAM Questions & Answers

Posted by Francisco Javier Aparicio Rebollo
On July 7, 2020
0

0 likes

In this post, you can read all the questions launched by the attendees, as well as all the answers offered by the speaker.

How to protect your COTS parts during C-SAM inspections.

Posted by Francisco Javier Aparicio Rebollo
On July 7, 2020
0

0 likes

The current post describes the different measures taken during Scanning Acoustic Microscopy (SAM) inspection to avoid potentially harmful effects associated with water immersion. Internal visual inspection conducted after decapsulation shows the successful prevention of corrosion phenomena in these samples.

Non-destructive internal inspection of EEE parts and passive components

Posted by Francisco Javier Aparicio Rebollo
On July 7, 2020
0

0 likes

Non-destructive testing methods are critical for the screening, inspection and failure analysis of plastic encapsulated and other EEE systems.

Scanning Acoustic Microscopy (C-SAM) of in Stacked Capacitors

Posted by Francisco Javier Aparicio Rebollo
On June 12, 2020
0

1 likes

Scanning Acoustic Microscopy (C-SAM) inspection has been used for the comprehensive inspection of the lead-frame in a horizontally stacked capacitor. This non-destructive inspection reveals minor anomalies at the interface with capacitor terminals which may impair the electrical response.

Ultrasonic Examination of Ceramic Capacitors by Scanning Acoustic Microscopy

Posted by Francisco Javier Aparicio Rebollo
On May 18, 2020
0

0 likes

Ultrasonic Examination of Ceramic Capacitors by Scanning Acoustic Microscopy (SAM) has proved to be the most effective tool for the non-destructive detection of very thin (even below 200 nm of thickness) internal anomalies (delamination, voids, cracks, and foreign material) within ceramic capacitors and other EEE parts