Non-Destructive Detection of Delaminations in PCBs Assemblies

Posted by Raquel Cano Cordero
On March 10, 2021
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Scanning Acoustic Microscopy (C-SAM) inspection has been used for the comprehensive inspection of the lead-frame in a horizontally stacked capacitor. This non-destructive inspection reveals minor anomalies at the interface with capacitor terminals which may impair the electrical response.

OpAmps in Plastic Packages

Posted by Francisco Javier Aparicio Rebollo
On December 17, 2020
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Plastic encapsulated Op-amps are very popular due to...

SAM, the preferred method for the non-destructive internal inspection

Posted by doEEEt Media Group
On December 16, 2020
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SAM, The Preferred Method For The Non-Destructive Internal Inspection. Scanning Acoustic Microscopy of COTS and plastic encapsulated microelectronics. Confocal Scanning Acoustic Microscopy (C-SAM) has proved to be the most effective non-destructive approach for the screening of COTS parts and the detection of latent internal anomalies in PEMs, either before soldering or for assembled systems.

C-SAM Questions & Answers

Posted by Francisco Javier Aparicio Rebollo
On July 7, 2020
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In this post, you can read all the questions launched by the attendees, as well as all the answers offered by the speaker.

Non-destructive internal inspection of EEE parts and passive components

Posted by Francisco Javier Aparicio Rebollo
On July 7, 2020
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Non-destructive testing methods are critical for the screening, inspection and failure analysis of plastic encapsulated and other EEE systems.

Scanning Acoustic Microscopy (C-SAM) of in Stacked Capacitors

Posted by Francisco Javier Aparicio Rebollo
On June 12, 2020
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Ultrasonic Examination of Ceramic Capacitors by Scanning Acoustic Microscopy

Posted by Francisco Javier Aparicio Rebollo
On May 18, 2020
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Ultrasonic Examination of Ceramic Capacitors by Scanning Acoustic Microscopy (SAM) has proved to be the most effective tool for the non-destructive detection of very thin (even below 200 nm of thickness) internal anomalies (delamination, voids, cracks, and foreign material) within ceramic capacitors and other EEE parts

Cracking Problems in Low-Voltage Chip Ceramic Capacitors

Posted by doEEEt Media Group
On October 14, 2019
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Guidelines for Selection of Ceramic Capacitors for Space Applications: Cracking Problems in Low-Voltage Chip Ceramic Capacitors