Passive Components Mounting Guidelines Workshop. The Passive Components Mounting Guidelines Workshop is dedicated to anyone interested in passive component mounting issues and impact of board mounting process to the reliability of the components.
Some of the technical sessions of The Electronic Components and Technology Conference (ECTC) were focused on research involving the embedding and integration of passive components in 3D configurations.
The Passive Component Raw Material Index has shown that costs to produce certain types of capacitors and resistors, with emphasis on MLCC and thick film chip resistors, have increased between FY2017 and FY2019
Two microcontrollers for space, the ATSAMV71Q21RT from Microchip Technology Nantes (formerly Atmel) and the UT32M0R500 from Cobham Microelectronic Solutions (formerly Aeroflex), are compared in this post
The SAL are aluminum electrolytic capacitors with anodic oxidized aluminum oxide as dielectric and with the semiconducting solid manganese dioxide as electrolyte (eased production Ss of December 31, 2015)
This post shows the basis to understand the Low Voltage Differential Signaling (LVDS) technology, including the benefits over other technologies, as well as different kind of devices and configurations available.
As a continuation of our previous post “Low Voltage Differential Signaling (LVDS) overview” it is shown a brief comparison between some LVDS drivers and receivers for high reliability and space application from different manufacturers
PTC thermistors are used as ICLs (inrush current limiters) to protect circuits of electrical and electronic devices against inrush currents easily and effectively.