Assembly, Capacitors, EPCI PCNS, Resistors, Sponsored
- Posted by doEEEt Media Group
- On June 28, 2019
2nd PCNS Passive Components Networking Symposium 10-13th September, Bucharest, Romania is pleased to announce Workshop focused on passive components mounting guidelines.
Mounting related induced failures are the number one reason (over 55%) for the field application capacitor failure causes according to a EPCI end customer survey – see figure below. The capacitor component failures itself represents “just” 33% of the root failure causes. Thus, a careful evaluation of mounting guidelines and follow up in real assembly processes per the component manufacturers’ recommendations shall be considered as a critical characteristic.
The first part of the workshop will focus on useful tips and tricks for passive component mounting issues, reliability of PCB assembly and finalization will be discussed during the second part of the workshop.
Attendees will receive printed manuscripts. Seating is limited and registration is mandatory using PCNS online form here. For rates and PCNS fee package information see the EPCI PCNSII Rates.
Passive Components Mounting Guidelines Workshop
Who Should Attend
The Passive Components Mounting Guidelines Workshop is dedicated to anyone interested in passive component mounting issues and impact of board mounting process to the reliability of the components.
Part I. Capacitors and Resistors Mounting Guidelines. Lecturer: Ing.Tomas Zednicek Ph.D., EPCI
Mounting techniques overview
Common Soldering Process Issues
PCB board design and handling
Soldering, PCB handling, and Rework
Part II. PCB assembly and finalization for high reliability, Lecturer: Ing. Vladimir Sitko, PBT Works s.r.o.
Threads for electronic assemblies reliability
Electrochemical migration conditions, consequences, electrochemical corrosion.
How to prevent electrochemical damage of assemblies. Cleaning and coating
How clean is cleaning enough, how can we measure that.
Recent changes in the cleaning process qualification and validation of changes
Biggest challenges of cleaning up to date electronic assemblies. PCB assemblies, DCB´s, components before encapsulation.
Current methods of cleaning process control. Options of process stability keeping and automation
Source: EPCI news
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