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125 results found for MIL-STD-88

Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status

MIL-STD-883, Method 1017

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Environmental Test Method Standard for Microcircuits: Neutron irradiation
The neutron irradiation test is performed to determine the susceptibility of semiconductor devices to nonionizing energy loss (NIEL) degradation.
DLA
Method
3 /
Active

MIL-STD-883, Method 1031

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Environmental Test Method Standard for Microcircuits: Thin film corrosion test
The thin film corrosion test is performed for the purpose of demonstrating the quality or reliability of devices subjected to the specified conditions over a specified...
DLA
Method
/
Active

MIL-STD-883, Method 5001

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Electrical Test Method Standard for Microcircuits: Parameter mean value control
The purpose of this method is to define a technique for assuring a conformance to a maximum or minimum mean of a parameter measured in any test method listed in...
DLA
Method
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MIL-STD-883, Method 5010

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Electrical Test Method Standard for Microcircuits: Test procedures for custom monolithic microcircuits
This method establishes screening, qualification, and quality conformance requirements for the testing of complex monolithic microcircuits to assist in achieving the...
DLA
Method
4 /
Active

MIL-STD-883, Method 3022

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Electrical Test Method Standard for Microcircuits: Input clamp voltage
This method establishes the means for assuring circuit performance to the limits specified in the applicable
DLA
Method
/
Active

MIL-STD-883, Method 3005

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Electrical Test Method Standard for Microcircuits: Power supply current
This method establishes the means for measuring power supply currents of digital microelectronic devices such as TTL, DTL, RTL, ECL, and MOS.
DLA
Method
1 /
Active

MIL-STD-883, Method 2025

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Mechanical Test Method Standard for Microcircuits: Adhesion of lead finish
This destructive test is intended to determine the integrity of all primary and undercoat lead finishes.
DLA
Method
4 /
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MIL-STD-883, Method 2031

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Mechanical Test Method Standard for Microcircuits: Flip chip pull-off test
The purpose of this test is to measure the strength of internal bonds between a semiconductor die and a substrate to which it is attached in a face-bond configuration
DLA
Method
1 /
Active

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Total ionization IS-2981EH
total dose test of the IS-2981EH octal source driver. Parts were irradiated to 200 krad(Si) at low dose rate under biased and unbiased conditions as outlined in...
TD
/ 0
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MIL-STD-883, Method 3011

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Electrical Test Method Standard for Microcircuits: Output short circuit current
This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document in regard to output short circuit...
DLA
Method
1 /
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