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125 results found for MIL-STD-88

Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status

MIL-STD-883, Method 2008

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Mechanical Test Method Standard for Microcircuits: Visual and mechanical
Method 2008 is canceled effective 15 November 1974
DLA
Method
1 /
Supersed

MIL-STD-883, Method 2007

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Mechanical Test Method Standard for Microcircuits: Vibration, variable frequency
The variable frequency vibration test is performed for the purpose of determining the effect on component parts of vibration in the specified frequency range. This is...
DLA
Method
3 /
Active

MIL-STD-883, Method 1009

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Environmental Test Method Standard for Microcircuits: Salt atmosphere (corrosion)
This test is proposed as an accelerated laboratory corrosion test simulating the effects of seacoast atmosphere on devices and package elements.
DLA
Method
8 /
Active

MIL-STD-883, Method 3004

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Electrical Test Method Standard for Microcircuits: Transition time measurements
This method establishes the means for measuring the output transition times of digital microelectronic devices, such as TTL, DTL, RTL, ECL, and MOS.
DLA
Method
1 /
Active

MIL-STD-883, Method 3024

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Electrical Test Method Standard for Microcircuits: Simultaneous switching noise measurements for digital microelectronic devices
This method establishes the procedure for measuring the ground bounce (and VCC bounce) noise in digital microelectronic devices or to determine compliance with...
DLA
Method
/
Active

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Total ionization HS-OP470ARH
total dose test of the HS-OP470ARH.Parts were tested at low and high dose rate under biased and unbiased conditions as outlined in MIL-STD-883 Test Method 1019.7,to a...
TD
/ 0
Active

MIL-STD-883, Method 2037

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Mechanical Test Method Standard for Microcircuits: X-Ray Fluorescence (XRF) Scan for Tin (Sn)-Lead (Pb) Content Analysis
The purpose of this test is to verify that the amount of Lead (Pb) in Tin-Lead (Sn-Pb) alloys and electroplated finishes contain at least 3 weight percent (wt%) Lead...
DLA
Method
/
Active

MIL-STD-883, Method 2027

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Mechanical Test Method Standard for Microcircuits: Substrate attach strength
The purpose of this test is to determine the strength of the element attachment system when subjected to force in the Y1 axis. This method is applicable to...
DLA
Method
2 /
Active

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Total ionization IS-139ASEH
Both the IS-139ASRH and IS-139ASEH are wafer-by-wafer assurance tested per MIL-STD-883H at 300krad(Si) of HDR (50 to 300 rad(Si)/s. Only the IS-139ASEH is...
TD
/ 0.00
Active

MIL-STD-883, Method 5011

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Electrical Test Method Standard for Microcircuits: Evaluation and acceptance procedures for polymeric adhesives.
This method establishes the minimum inspection procedures and acceptance criteria for polymeric materials used in microcircuit applications.
DLA
Method
7 /
Active
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