125 results found for MIL-STD-88
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
This method establishes the means for measuring the output transition times of digital microelectronic devices, such as TTL, DTL, RTL, ECL, and MOS.
DLA
Method
1 /
Active
This method establishes the procedure for measuring the ground bounce (and VCC bounce) noise in digital microelectronic devices or to determine compliance with...
DLA
Method
/
Active
total dose test of the HS-OP470ARH.Parts were tested at low and high dose rate under biased and unbiased conditions as outlined in MIL-STD-883 Test Method 1019.7,to a...
TD
/ 0
Active
The purpose of this test is to verify that the amount of Lead (Pb) in Tin-Lead (Sn-Pb) alloys and electroplated finishes contain at least 3 weight percent (wt%) Lead...
DLA
Method
/
Active
The purpose of this test is to determine the strength of the element attachment system when subjected to force in the Y1 axis. This method is applicable to...
DLA
Method
2 /
Active
The purpose of this test is to detect loose particles inside a device cavity. The test provides a nondestructive means of identifying those devices containing...
DLA
Method
9 /
Active
The purpose of this test procedure is to measure small signal power gain and the noise figure of an amplifier.
DLA
Method
2 /
Active
This test procedure defines the requirements for testing the response of packaged digital integrated circuits to pulsed ionizing radiation.
DLA
Method
3 /
Active
The purpose of this method is to reveal nonacceptable wire bonds while avoiding damage to acceptable wire bonds.
DLA
Method
7 /
Active
The purpose of this examination is to nondestructively detect unbonded regions, delaminations and/or voids in the die attach material and at interfaces within devices...
DLA
Method
2 /
Active