125 results found for MIL-STD-88
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
This method establishes the requirements for the lot acceptance testing of microcircuit wafers intended for class level S use.
DLA
Method
8 /
Active
This method establishes qualification and quality conformance inspection procedures for microelectronics to assure that the device and lot quality conforms with the...
DLA
Method
17 /
Active
The purpose of this test method is to quantitatively measure the gas atmosphere inside a metal or ceramic hermetically-sealed device using mass spectrometry methods.
DLA
Method
10 /
Active
This method establishes a means for assuring circuit performance during cold temperature start up. It defines an activation time for digital microelectronic devices...
DLA
Method
1 /
Active
This test method is performed to determine whether termination leads and other component parts can withstand the effects of the heat to which they will be subjected...
DLA
Method
1 /
Active
Product was not tested correctly for Constant Acceleration requirement per MIL-STD-883 TM2001 Condition E
Alert Documents
/
Active
The thin film corrosion test is performed for the purpose of demonstrating the quality or reliability of devices subjected to the specified conditions over a specified...
DLA
Method
/
Active
The purpose of this method is to define a technique for assuring a conformance to a maximum or minimum mean of a parameter measured in any test method listed in...
DLA
Method
/
Active
This method establishes screening, qualification, and quality conformance requirements for the testing of complex monolithic microcircuits to assist in achieving the...
DLA
Method
4 /
Active
This method establishes the means for assuring circuit performance to the limits specified in the applicable
DLA
Method
/
Active