125 results found for MIL-STD-88
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test is to inspect passive elements used for microelectronic applications, including RF/microwave, for the visual defects described herein.
DLA
Method
3 /
Active
This method establishes the means for assuring device performance to the limits specified in the applicable acquisition document in regard to input and output...
DLA
Method
1 /
Active
The purpose of this test is to determine a representative failure rate for microelectronic devices or to demonstrate quality or reliability of devices subjected to the...
DLA
Method
1 /
Active
The low dose rate work was performed at 0.10rad(Si)/s and the hig dose rate work was performed at 60rad(Si)/sper MIL-STD-883 Method 1019 as part of the Intersil wafer...
TD
/ 0
Active
The purpose of this method is to detect unbonded and insufficiently bonded sites in TAB (Tape automated bonding) devices in the open package condition, through the...
DLA
Method
/
Active
The barometric-pressure test is performed under conditions simulating the low atmospheric pressure encountered in the nonpressurized portions of aircraft and other...
DLA
Method
/
Active
This method establishes the means for measuring common mode input voltage range, common mode rejection ratio, and supply voltage rejection ratio.
DLA
Method
2 /
Active
The purpose of this test procedure is to measure gain, bandwidth, distortion, dynamic range, and input impedance. Gain, dynamic range, and distortion are combined into...
DLA
Method
2 /
Active
Latchup shall be performed in accordance with JEDEC JESD78. JEDEC JESD78 supersedes JEDEC-STD-17.
DLA
Method
2 /
Active
The purpose of this test method is to verify the workmanship of packaged devices. This test method shall also be utilized to inspect for damage due to handling,...
DLA
Method
14 /
Active