- Posted by doEEEt Media Group
- On February 20, 2019
Destructive Physical Analysis DPA is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements.
In a DPA parts are examined for a wide variety of design, workmanship, and processing problems which may not show up during the previous inspection, test and screening activities performed by the component manufacturer. Save time searching the EEE components of your design in doEEEt database. Anomalies and defects which are detected through DPA could, at some later date, cause degradation or failure of the system in which the devices are to be employed. DPA is conducted on samples taken randomly from the lot and consists of a series of various tests and inspections depending on the type of the component and package. Among them:
- X-ray Examination
- External Visual Inspection
- Seal tests (Fine& Gross leaks)
- Particle Impact Noise Detection (P.I.N.D)
- Internal Visual Inspection
- Bond Pull
- Scanning Electron Microscope (SEM)
- Die Shear
RF filter failure detected during the internal visual inspection which is a part of the cross sectioning process.
Hybrid device after the opening process
SEM inspection of metallization after removing the glassivation.
- Automotive SiC module technology analysis and radiation testing - September 22, 2022
- Bourns Expands its High-Power Fuse Family for EVs - September 16, 2022
- NASA Efforts in Utilizing Commercial-Off-The-Shelf (COTS) Electronics in Mission Systems - September 16, 2022