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INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Press-Fit connectors qualification for space

  • Posted by Francisco Javier Aparicio Rebollo
  • On May 15, 2021
  • 0

Press-Fit connectors – Conference paper to the Space Passive Components Days October 2018.

The burgeoning demand for the incorporation of disruptive technologies into space industry clearly requires fast and reliable procedures for the space qualification of these innovative components. This also entails a close collaboration between the manufacturing and qualification laboratories not only to determine the reliability but also to analyze the root cause of eventually present fails, as a first step for the development of enhanced qualified products.

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A clear example of this collaboration, we assess the implementation of press-fit connectors conceived for PCB systems in space application. The good results and the accuracy of the comprehensive study were presented at the Space Passive Components Days Symposium (SPCD) that was held on October 2018 at the ESA European Space Research and Technology Centre (ESTEC).

SPCD is an ESA organized conference where the most important space research institutions, manufacturers and public bodies (ESA, NASA, and JAXA) present their innovations in the state of the art of space passive components.

The presented work illustrates the capabilities of Alter Technology to conduct verification programs on PCB assembled systems. In fact, this is a complex process that involves strict environmental test as well as accurate and thorough electrical measurements and microsection inspections as indicated in the test flow below.

Download here the full paper

Press-Fit connectors

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Francisco Javier Aparicio Rebollo
Francisco Javier Aparicio Rebollo
Degree in Physics and Ph.D. in Materials Science by the University of Seville.

Since 2007 Dr. Aparicio has developed a productive research career within the field of Materials Science including post-doctoral stays at the University of Trento, the University of Mons, and the Spanish National Research Council (CSIC). His researches have been published in more than 30 articles in reputed international research journals and conferences (> 70) including more than 10 invited talks and lectures.

Within the frame of the program “Torres Quevedo” for the Knowledge Transfer and the incorporation of research talent into the industry, in 2019 he joined Alter Technology as Senior Materials Science Test Engineer. In 2019 he was appointed to lead the Scanning Acoustic Microscopy Service. Within this framework, he currently collaborates in different ESA projects (JUICE and PLATO).”

Actually, he is not in our company anymore, but still as an external collaborator in our blog.
Francisco Javier Aparicio Rebollo
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TAGS: EEE PARTS EXTERNAL VISUAL INSPECTION EEE PARTS MICROSECTIONING EEE PARTS THERMAL CYCLING EEE PARTS VIBRATION TEST EVALUATION HI-REL MATERIAL PROCESSES INCOMING INSPECTION Other Connectors PCB ASSEMBLY Positronic QUALIFICATION

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