BGA device assembled to a PCB has been submitted to the ECSS verification programme following the guideline defined in the ECSS standard ECSS-Q-ST-70-38C. Metallographic analysis allows us to check the status of such devices after performing the environmental tests (Vibration & Thermal Cycling).
Cross-section analysis is a very useful way of determining the construction and material composition of electronic devices.
The FP device is potted in epoxy resin. After curing, the sample is sequentially grinded up to reach the plane of interest. Then, the specimen is subjected to several polishing steps to achieve a high-quality surface to be analyzed by metallographic microscopy.
Microsection analysis is performed on an assembled through hole device as a part of a failure analysis. Cross-section through the plane of interest can provide helpfully information about solder defects, PCB inner layers and internal construction. As a part of a failure analysis, the plane of interest has to be selected taking into account PCB characteristic, observed failure and previous test results.
In this post are addressed two product change notifications (PCN) affecting to 4006/014 type variants. Changes which have been discussed and agreed with ESA without any effect on the qualification status of ESCC qualified devices
Modern manufacturing techniques depend on 3D measurement data combined with CAD/CAM techniques for quality control of high-precision components or mass production. Typically, contact measurement has been widely utilized by the industry. However, for complex and small 3D structures, the application of contact measurement is cumbersome or sometimes impossible. Therefore, noncontact measurement has gradually received much attention from researchers and industry.
The separation of the interest area has to be performed in such a way as to prevent any damage by deformation or input of heat. After cleaning, the specimen is encapsulated before the grinding process takes place.
Assembly process of THT or SMT onto PCBs for spacecraft applications follow well-established design requirements based on specifications prepared by ECSS (ECSS-Q-ST-70-08C & ECSS-Q-ST-70-38C), NASA and IPC (IPC-6012).