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Microcircuit Standards Development for Space Missions

  • Posted by doEEEt Media Group
  • On September 16, 2022
  • 0
This presentation will describe the efforts underway where NEPAG has worked with DLA (Defense Logistics Agency), JC-13 (the manufacturers of government products), and CE-12 (the users of active devices) committees to ensure current military/aerospace standards address many challenges, one example being the insertion of new technology, the Class Y initiative, Class Y represents advancements in packaging technology, increasing functional density, and increasing operating frequency.
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AMD completes acquisition of Xilinx

  • Posted by Javier Alejandro de la Ossa Fernández
  • On February 25, 2022
  • 0
Acquisition of Xilinx in an all-stock transaction. creates the industry’s high-performance and adaptive computing leader with significantly expanded scale and the strongest portfolio of leadership computing, graphics, and adaptive SoC products.
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Issue 222 of ESCC QUALIFIED PART LIST (QPL)

  • Posted by Javier Alejandro de la Ossa Fernández
  • On November 15, 2021
  • 0
This post provides information about the latest changes in issue 222 of ESCC QUALIFIED PART LIST (QPL) included in the DCR 1474.
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Ceramic Hermetic DDR2 SDRAM Memory avalaible for Space

  • Posted by Manuel Padial Pérez
  • On September 13, 2021
  • 0
DDC's 97D2H is a hermetically sealed ceramic DDR2 SDRAM Memory for space and features high-speed operation with up to 8 Gbits of memory. Optional RAD-PAK® shielding provides greater total dose tolerance, to support missions with greater radiation exposure
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Radiation Tolerant Solid State Drives (SSD)

  • Posted by Manuel Padial Pérez
  • On September 1, 2021
  • 0
Aerospace developers and Space engineers are looking towards non-volatile memories such as NAND flash and solid state drives as alternatives for mass storage in space applications
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Microchip’s Low-Power Radiation-Tolerant (RT) PolarFire® FPGA Enables High-Bandwidth Space Systems with Lower Total System Cost

  • Posted by Microchip Technology 
  • On July 18, 2021
  • 0
Developers of spacecraft electronics use radiation-tolerant (RT) field programmable gate arrays (FPGAs) to create on-board systems that meet the demanding performance needs of future space missions, survive the brutal launch process and continue to operate reliably in the harsh environment of space
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CRANE INTERPOINT Redmond Facility move to Lynnwood

  • Posted by Manuel Padial Pérez
  • On July 3, 2021
  • 0
Crane Interpoint facility located in Redmond, (WA), has been relocated to Crane’s existing Lynnwood, WA site
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Issue 218 of ESCC QUALIFIED PART LIST (QPL)

  • Posted by Javier Alejandro de la Ossa Fernández
  • On June 22, 2021
  • 0
This post provides information about the latest changes in issue 218 of ESCC QUALIFIED PART LIST (QPL) included in the DCR 1430.
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Radiation Hardened Integrated Circuits made in Germany

  • Posted by Manuel Padial Pérez
  • On June 21, 2021
  • 0
SPACE IC includes in its portfolio three space/radiation-hardened integrated circuits: SPPL12420RH point of load converter, and SPLVDS031RH/SPLVDS032RH a pair of quad LVDS line driver and receiver
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Plastic Rad Tolerant Microchip Products for New Space

  • Posted by Manuel Padial Pérez
  • On February 26, 2021
  • 0
Microchip’s AVR8 ATmegaS64M1/ATmegaS128 and ARM32 M7 SAMV71Q21 Flight Models (FM) are available in ceramic package with screening equivalent to QML class Q and QML class V quality levels. Engineering samples are available as well. Developing radiation-hardened systems for space applications means long lead times and high cost toward achieving the necessary levels of reliability for multi-year missions in harsh environments.
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