Military and Aerospace Set for Growth in 2020s

  • Posted by doEEEt Media Group
  • On May 28, 2020
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After the Space Shuttle was retired in 2011, the United States had to rely on Russia to bring astronauts to and from orbit. Today, we’re preparing for SpaceX and Boeing to fly crews to the International Space Station. In the last decade, the F-35 entered its second decade of development; today, more than 400 aircraft have been delivered.

Hermetic Packages in Space Environment

  • Posted by Javier Alejandro de la Ossa Fernández
  • On February 27, 2020
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    • 2 likes
The general specification for hybrid microcircuits (MIL-PRF-38534) details the qualification and testing requirements for non-hermetic packages for military and space applications, and the MIL-PRF-38535 proposed class Y monolithic microcircuits for non-hermetic space level.

Plastic Rad Tolerant Microchip Products for New Space

  • Posted by Manuel Padial Pérez
  • On February 26, 2020
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    • 5 likes
Microchip’s AVR8 ATmegaS64M1/ATmegaS128 and ARM32 M7 SAMV71Q21 Flight Models (FM) are available in ceramic package with screening equivalent to QML class Q and QML class V quality levels. Engineering samples are available as well. Developing radiation-hardened systems for space applications means long lead times and high cost toward achieving the necessary levels of reliability for multi-year missions in harsh environments.

Solid State Relays (SSR) for Space Applications

  • Posted by José Francisco Largaespada
  • On February 24, 2020
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The solid-state relay has no moving parts and uses the electrical and optical properties of solid-state semiconductors to perform its input to output isolation and switching functions

MICROCHIP FPGAs External Visual Inspection Considerations

  • Posted by Antonio Rodríguez Arenas
  • On January 20, 2020
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One of the quality assurance inspections that are performed in EEE parts is external visual inspection. The applicable method for Microchip FPGAs as well as for other parts with generic specification MIL-PRF-38535, is MIL-STD-883 Method 2009.

Hot Solder Dip Acceptance Criteria

  • Posted by Antonio Rodríguez Arenas
  • On December 20, 2019
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    • 1 likes
Hot Solder Dip Acceptance Criteria for Flat Pack Packages. Different standards can be considered to determine the acceptance of the Hot Solder Dip activity on EEE components

DLA SMD Part Numbering Breakdown

  • Posted by Manuel Padial Pérez
  • On December 18, 2019
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    • 3 likes
SMD stands for Standard Microcircuit Drawing, which refers to documents generated by the US Defense Logistics Agency Land and Maritime (DLA), the former Defense Supply Center Columbus (DSCC).
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