EEE Components, INSPECTION, ELECTRICAL & VERIFICATION

Idiosyncrasy of International Space Markets

Posted by Jose Luis Alvarez de Cienfuegos Gálvez
On August 30, 2020
0

IDIOSYNCRASY OF INTERNATIONAL SPACE MARKETS Six decades have passed since the launch of the first artificial satellite by the USSR (Sputnik) and five decades since the landing of human beings on the Moon (Apollo project -USA-), two of the greatest landmarks of the space race that began in the shadow of the “Cold War” between the US and the USSR. After the conquest of the new world in the 16th century, this is considered a new turning point in the history of humanity that leads some authors to claim it as the beginning of a new period of history: The Space Age.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Which are the improper degrees of Crimped Connectors?

Posted by Francisco Javier Aparicio Rebollo
On August 21, 2020
0

Stress relaxation: decrease of the contact pressure held between the wires and at the wire-barrel interface, Improper crimping: neither damage the insulation of the wire strands nor to leave insulator residues over the stripped conductor. Diagnosis tools: improper degree of compression and related issues can be detected either

Microsectioning - Short Technical Notes, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Evaluation of PCB in Alter Technology Lab.

Posted by Mari Carmen López
On July 25, 2020
0

The separation of the interest area has to be performed in such a way as to prevent any damage by deformation or input of heat. After cleaning, the specimen is encapsulated before the grinding process takes place.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

MIL-STD-883 METHOD 2003 – Solderability Testing

Posted by Manuel Padial Pérez
On July 23, 2020
0

The Mil-Std-883 Method 2003 Is One Of The Oldest And Most Widely Used Standards For Solderability Testing.

Microsectioning - Short Technical Notes, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Evaluation of Electronic Assemblies

Posted by Mari Carmen López
On July 18, 2020
0

Assembly process of THT or SMT onto PCBs for spacecraft applications follow well-established design requirements based on specifications prepared by ECSS (ECSS-Q-ST-70-08C & ECSS-Q-ST-70-38C), NASA and IPC (IPC-6012).

EEE Components, MANUFACTURER NOTIFICATION, PASSIVES

Glass Encapsulated Beads ESCC 4006/014 Type NTC Thermistors

Posted by Manuel Padial Pérez
On July 12, 2020
0

In this post are addressed two product change notifications (PCN) affecting to 4006/014 type variants. Changes which have been discussed and agreed with ESA without any effect on the qualification status of ESCC qualified devices

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Need a 3D Characterization Testing? Use Scanning Microscopy CLSM

Posted by Fernando Teberio
On July 2, 2020
1

Modern manufacturing techniques depend on 3D measurement data combined with CAD/CAM techniques for quality control of high-precision components or mass production. Typically, contact measurement has been widely utilized by the industry. However, for complex and small 3D structures, the application of contact measurement is cumbersome or sometimes impossible. Therefore, noncontact measurement has gradually received much attention from researchers and industry.

Alter Technology Services

Product Assurance Support

Posted by Guillermo Largaespada
On April 5, 2020
0

The activity of product assurance (PA) support performed by Alter technology engineers is being more and more demanded and appreciated by space customers due to the high level of mastering required on components technology knowledge, space requirement/environment understanding, failure mode mechanism, data accessibility/analysis/assessment, margin and derating rules, testing at component/board/equipment level…

ALTER Laboratory Services

Solderability Test

Posted by Manuel Padial Pérez
On March 28, 2020
0

Solderability test refers to the process of evaluating the solderability of terminations (i.e., component leads, lugs, terminals, wires, etc.). which are normally joined by a soldering operation. The solderability determination is based on the ability of the terminations to be wetted by the molten solder after accelerated aging.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Raman Thermometry Technique on Hi-Rel EEE Parts

Posted by Francisco Javier Aparicio Rebollo
On March 19, 2020
0

As typical length in integrated circuits decreases thermal management is becoming a key factor determining the reliability and lifetime of such systems. Furthermore, micrometric and submicrometric objects in integrated circuits modify local heat transport and may lead to the formation of unintentional hot-spots. Thus, the accurate measurement of the local temperature with micrometric spatial resolution is crucial to confirm the suitable operation of highly integrated systems.

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