PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Soldering Verification of EEE parts SMD and PCBs

Posted by Mari Carmen López
On May 16, 2019
0

High reliability assembled PCB prototypes as well as novel surface mounted devices (SMD) and mixed systems must be assessed according to well defined qualification test plans. Such high reliability verification programmes are not limited to just evaluate the robustness, reliability and performance of the product but they also address the verification of tools, fabrication procedures and involved materials, as well as the confirmation of product integrity. For instance, ECSS (European Cooperation for Space Standardization” (ECSS) standards used in space programs

EEE Components, PASSIVES

MLCC cracking issues in low voltage is report & evaluates by NASA

Posted by Tomáš Zedníček
On May 15, 2019
0

Report prepared by Alexander Teverovsky, ASRC Federal Space and Defense. NASA recently released an extensive 70pages report on low voltage MLCC cracking issues published on nepp.nasa.gov. The report in detail describes the manufacturing process of MLCC types, provide comparative analyses of MIL, NASA vs ESA vs JAXA specifications, explains qualification procedures and cracking risk issues including degradation and failure mechanisms. The final section recommends methods for workmanship and failure detection.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

What is SEM EDS as Internal Material Analysis?

Posted by Francisco Javier Aparicio Rebollo
On May 2, 2019
0

This analytic technique may provide both qualitative and quantitative information of the composition of a surface, i.e. identification of the elements and the element weights, respectively. The technique relies on the detection and spectroscopy of secondary radiation (X-Ray) emitted when a high-intensity incident beam of electrons impinges upon the materials placed in its path. The SEM – EDS Internal Material Analysis (also known as EDX or EDAX) can be performed in accordance with MIL-STD-883, MIL-STD-750, MIL-STD-1580 and ESCC 25500 requirements.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Tin Whisker Growth Investigation Conclusions

Posted by Dimas Morilla
On April 4, 2019
2

It is important to be vigilant in the procurement of electronics components, particularly for space components, because once launched, they cannot be repaired and many spacecraft have intended lives of 14 years and some like Pioneer will continue communicating with Earth for more than 40 years.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

How and Why Tin Whisker Grow in Electronic components

Posted by Dimas Morilla
On April 4, 2019
0

The Tin Whisker is a conductive hairy-like crystalline structure of tin that grow spontaneously from a tinned surface, usually as a result of the stress of some sort, and maybe long enough to cause a big problem for those applications demanding a high level of reliability.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Thermographic analysis Techniques used for EEE Parts

Posted by Emilio Cano García
On March 28, 2019
0

Thermographic analysis techniques used in Alter Technolgy : Infrared camera thermal maps, Thermal behavior of equipment and cabinets, Thermal analysis at customer specified temperature conditions. The analysis of the distribution of the dissipated heat in cabinets or enclosures gives relevant information for checking the reliability of a system and its components.

ENDURANCE, ENVIRONMENTAL & RADIATION, TESTING

Thermal Vacuum Testing for Space Applications

Posted by doEEEt Media Group
On March 28, 2019
0

The environmental conditions in the space are extreme, the combination of low pressure and the extreme temperatures can cause the failure of a component. That is why we test the components in similar conditions.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Different types of Corrosion / Contamination in Crimped Connectors

Posted by Francisco Javier Aparicio Rebollo
On March 14, 2019
0

Crimped connectors are gas-tight junctions ideally protected against environmental contaminants and corrosive agents. Nonetheless inappropriate crimping and inherent connector and wire defects reduce this protection. Thus, depending of the storage atmosphere, non-conducting corrosion products can be formed, or stress corrosion cracking can be eventually induced. The former act as insolation layer that reduces the connector conductivity and both corrosion effects are identified as critical factors involved in common fails reported for electrical connectors.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Reasons to do an Element Evaluation Procedure of EEE Parts

Posted by doEEEt Media Group
On March 14, 2019
1

Element evaluation is performed on a sample of randomly selected parts from a production lot, (if die, they are assembled into packages). These parts are then subjected to a series of tests selected to verify the reliability of the parts (Electrical, screening, environmental, endurance and mechanical tests) and the production lot from which they originated. The Element Evaluation is performed to show that the parts performance, materials and manufacturing processes are able to meet their specified electrical, mechanical and physical performance characteristics for which they were designed-and as a result, their suitability for use in the application in which they are intended to be used.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Identifying Leakage Pathway with a Penetrant Dye Gross Leak Test

Posted by David Ramirez - Cruzado
On March 13, 2019
0

Penetrant dye gross leak test is used to identify leakage pathways within hermetic and non-hermetic devices, such as glass body devices or plastic encapsulated parts. The test provides a definitive view of the leak paths including cracks, voids, delaminations and other fractures.

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