EEE Components, MANUFACTURER NOTIFICATION, PASSIVES

Mini Systems Thin Film Division Will Use PECVD Process

Posted by Manuel Padial Pérez
On July 31, 2019
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The Product/Process Change Notification (PCN) #19-001 informs about the changes in the deposition method of dielectric material, silicon dioxide, used as a protective glassivation layer over thin-film resistors

ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Advanced Techniques in EEE Components Testing for Space applications

Posted by doEEEt Media Group
On June 24, 2019
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The reliability of the components used in a spacecraft is a determinating factor for their operation and performance throughout the mission life. Only the most advanced techniques are able to provide the depth and accuracy in the inspections required by current state of the art microelectronics.