Humidity may affect the life expectancy of a component by creating stresses on the part materials and altering its electrical properties in a way that the component reliability is significantly diminished.
Temperature Humidity Test is those performed with the aim of evaluating the properties of materials used in components and the reliability of non-hermetic packaged devices in humid environments.
Tests, inspections or combination thereof, imposed on 100% of parts to remove unsatisfactory items or those likely to exhibit early failures.
Using stress testing, defects are weeded out in a product where the root causes cannot be eliminated. Removing all the defective parts (infant mortality) brings the lot to the constant failure rate (working life) phase.
The screening does not increase the reliability of the components but removes those showing weakness or defects. Tests, inspections or combination thereof, imposed on 100% of parts to remove unsatisfactory items or those likely to exhibit early failures.
During the Evaluation phase, components/technologies can be expensively characterized and margins determined.
If the evaluation is successful we can then proceed with Qualification, on components produced strictly as defined in the final PID (Process Identification Document) and from a given lot (actually, the first production lot).
Once qualified, the component is listed in the QPL (Qualified Part List).
Thermographic analysis techniques used in Alter Technolgy :
Infrared camera thermal maps,
Thermal behavior of equipment and cabinets,
Thermal analysis at customer specified temperature conditions.
The analysis of the distribution of the dissipated heat in cabinets or enclosures gives relevant information for checking the reliability of a system and its components.
Electronic Components Thermal shock testing is performed to determine the ability of parts to function properly in an environment with sudden extreme changes in temperature. It is also used for accelerated testing during product evaluation and qualification process.
The environmental conditions in the space are extreme, the combination of low pressure and the extreme temperatures can cause the failure of a component. That is why we test the components in similar conditions.
The objective of thermal cycling testing is to determine the ability of parts and solder interconnects to resist extremely high and low temperatures, as well as their ability to endure cyclical exposures to extreme temperatures.