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    • EEE COMPONENTS
    • SPECIFICATIONS / QPLs
    • EVENTS / WEBINARS
    • SPACE TALKS
    • TECH ARTICLES
    • MANUFACTURERS NOTIFICATIONS
  • Laboratory Services
    • LABORATORY STANDARD TESTING
    • NON STANDARD TESTING
    • SILICON CARBIDE -SiC- DIODES
    • CROWDTESTING
    • OPTOELECTRONICS
    • SMALL SATS
    • REPRESENTATIVE PROJECTS / PAPERS
  • Additional Services
    • INDUSTRY 4.0 CYBERSECURITY (IEC 62443)
    • PENETRATION TEST
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    • CODE SCORE MATRIX
    • LONG-TERM STORAGE OF WAFERS
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ACTIVES, EEE Components, ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

BepiColombo

  • Posted by doEEEt Media Group
  • On December 11, 2020
  • 0
Bepi Colombo will provide an understanding of Mercury to date. It consists of two individuals orbiters, Mercury Planetary Orbiter & Magnetospheric Orbiter
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INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Looking at Device Internal Structure by a Cross sectioning of EEE Parts

  • Posted by Francisco Javier Aparicio Rebollo
  • On November 27, 2020
  • 0
The cross-sectioning process provides access to the device internal structure, its materials and design. Such components as diodes and capacitors and silicon dice are often subjected to cross-sectioning to detect the defects which could not be found using other testing techniques.
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PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

How are the degolding and rettinning processes in EEE parts done

  • Posted by Aintzane Lujambio Genua
  • On October 27, 2020
  • 0
The procurement, evaluation, screening and lot acceptance of RF devices in leadless SMD packages to be used in spacecraft applications show unexpected difficulties whenever de-golding or retinning processes are required. This is associated to the induced lack of coplanarity in the contacts after those.
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ABC of CLR, EEE Components, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Mounting Guidelines: Soldering, PCB Handling & Rework

  • Posted by Tomáš Zedníček
  • On October 18, 2020
  • 1
What are the optimum soldering conditions and solder fillet? The best solder fillet for all SMT applications is one which makes a reliable connection and which best withstands the environmental exposures of the products with minimum degradation. This fillet is difficult to describe quantitatively for all parts. The optimum fillet ranges in height from about 1/3 to 2/3 of the part termination height. This does not mean that all solder joints outside of this range should be repaired. It does mean that this is the target for the process engineer to reach for in his process. As many as possible of the solder fillets on the board should be in this range.
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PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Bond Pull Test

  • Posted by Jesús Enrique Barbero Muñoz
  • On October 14, 2020
  • 0
The purpose of Bond Pull Test is to measure bond strengths, to evaluate bond strength distributions and to determine compliance with specified bond strength requirements of the applicable acquisition document in order to ensure the proper manufacturing process and long-term reliability of the bonds under stress conditions, such as vibration, shock, thermal cycling or wearout phenomena.
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ALTER Projects, ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

SENTINEL 3A

  • Posted by doEEEt Media Group
  • On October 14, 2020
  • 0
The Sentinels are a fleet of satellites designed to deliver the wealth of data and imagery that are central to the European Commission’s Copernicus programme.
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ALTER Projects, ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

PLAnetary Transits and Oscillations of stars PLATO

  • Posted by Alvaro Real
  • On October 9, 2020
  • 0
Alter Technology is the coordinated procurement agency for all the electronic components on-board providing engineering, testing and logistics services helping to the The European Space Agency (ESA) in the new mission with the PLAnetary Transits and Oscillations of stars (PLATO); which has the goal to detect terrestrial exoplanets in the habitable zone of solar-type stars and characterizing their bulk properties from 2024 onwardsplato.
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PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Mechanical Shock Test for Electronic devices

  • Posted by María Teresa Rodríguez
  • On October 8, 2020
  • 0
The purpose of mechanical shock testing is to evaluate the reliability of devices subjected to severe shocks which might result from suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation.
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ALTER Projects, ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

JUICE Jupiter Icy Moons Explorer

  • Posted by Israel Pedroche
  • On October 4, 2020
  • 0
JUpiter ICy Moons Explorer (JUICE) is a spacecraft designed by Airbus Defence and Space for the European Space Agency (ESA) mission to fly the Jovian system. It is the first Large-class mission in ESA’s Cosmic Vision 2015–2025 programme.
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PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Why Crimped Connector Mechanics Failure?

  • Posted by Francisco Javier Aparicio Rebollo
  • On September 21, 2020
  • 0
Crimped connectors are extensively present in EEE systems because of the good performance and easier installation at reduced dimension. Due to the key role played, they are required to have high durability even under harsh operating conditions. In the case of unexpected/early failure, thorough diagnosis and deep understanding of the main failure causes are the starting point to preclude future occurrence and improve the system reliability.
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