460 results found for MIL-STD
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test method is to check the materials, design, construction, and workmanship of discrete semiconductor diodes and other two-terminal semiconductor...
DLA
Method
6 / A w/Change4
Active
The purpose of this test method is to establish a standard approach for conducting heavy ion irradiation of planar vertical power MOSFET semiconductor devices.
DLA
Method
1 / A w/Change4
Active
The purpose of this test is to detect loose particles inside a device cavity. The test provides a nondestructive means of identifying those devices containing...
DLA
Method
9 /
Active
The purpose of this test procedure is to measure small signal power gain and the noise figure of an amplifier.
DLA
Method
2 /
Active
This test is conducted for the purpose of determining electrical contact reliability under low-level switching conditions in the environment in which the contacts...
DLA
Method
/
Active
The purpose of this test is to verify that the magnetic permeability of a test item is below a specified value.
DLA
Method
/ A
Cancelled
This test procedure defines the requirements for testing the response of packaged digital integrated circuits to pulsed ionizing radiation.
DLA
Method
3 /
Active
The purpose of this method is to reveal nonacceptable wire bonds while avoiding damage to acceptable wire bonds.
DLA
Method
7 /
Active
The purpose of this examination is to nondestructively detect unbonded regions, delaminations and/or voids in the die attach material and at interfaces within devices...
DLA
Method
2 /
Active
The purpose of preseal burn-in is to identify marginal devices or stabilize monolithic, hybrid, or multichip microcircuits prior to the sealing of packages so that...
DLA
Method
2 /
Active