MIL-STD-750, Method 2076 Mechanical Test Methods for Semiconductor Devices Part 2: Radiography
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The purpose of this test is to nondestructively detect defects within the sealed case of a semiconductor device, especially those resulting from sealing of the lid to the case, and internal defects such as foreign objects, improper interconnecting wires, and voids in the die attach material.
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MIL-STD-750, Method 2076
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MIL-STD-750, Method 2076
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