461 results found for MIL-STD

This section describes detailed requirements for a DPA of commonly used RF devices. These requirements supplement the general requirements in section 4.

The purpose of this test method is to determine the small signal junction capacitance of the tunnel diode under the specified conditions.

This method establishes screening procedures for total lot screening of microelectronics to assist in achieving levels of quality and reliability commensurate with the...

This test procedure defines the detailed requirements for performing latchup testing of microcircuits to identify susceptibility to dose rate induced latchup.

The purpose of this test is to determine the ability of connectors to withstand the effects of controlled amounts of ozone.

This resistor noise test method is performed for the purpose of establishing the "noisiness" or "noise quality" of a resistor in order to determine its suitability for...

The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package...

This test is conducted for the purpose of determining the electrical contact reliability of such items as electromechanical relays, switches, etc., under intermediate...

The purpose of this test method is to determine compliance with the specified lambda for semiconductor devices subjected to the specified conditions.

This test method is designed to evaluate the short term leakage stability of semiconductor devices under reverse bias conditioning.