- Posted by Francisco Javier Aparicio Rebollo
- On September 3, 2019
Hybrid microelectronics within plastic packages are comprehensively inspected thanks to the con-focal resolution provided by the scanning acoustic microscopy technique. The high depth resolution allows us to resolve top and inner metallic layers of the laminate.
Con-focal scanning acoustic microscopy is used to thoroughly inspect features at different layers of hybrid multichip modules (MCM). The inspection does not reveal rejectable features at the different discrete components included in this assembly, either active (ICs and semiconductor dice) or passive (resistors, capacitors and inductors), and over the top metallic layer. Non-circuit side inspection is used to assure the lack of delamination within the laminate (e.g. inner metallic layers).
Assesment as per different test methods
In Alter Technology scanning acoustic tomography inspection of plastic encapsulated microcircuits (PEMs) and similar systems is conducted in accordance with different inspection methods (J-STD-020E, ESCC 25200, PEM-INST-001, MIL-STD-1580 and others). Nonetheless, in the matter at hand, specification J-STD-020E is the most suitable as it includes specific requirements for the inspection of substrate-based packages, such as the laminated multichip module (MCM-L) herein analyzed. In this case, no anomalies are observed in agreement to this specification.
Sample & Method
A RF Variable Gain Amplifier (VGA) module encapsulated in a MCM package is investigated. Probe frequencies and inspection procedure are adapted to the internal structure of this plastic encapsulated microelectronic part. In this case the architecture of the system includes both thick and thin discrete components onto a multilayer laminates substrate. Therefore, circuit side inspection is conducted using a low frequency transducer to extend the depth of field whereas the high frequency transducer used during the non-circuit side inspection allows us to resolve inner conductive layers within the laminate.
- SAM Capabilities, Analyse the internal structure in EEE Parts - February 24, 2021
- Verifying the Structural Quality of the Glassivation Layer - February 21, 2021
- What does Electrothermal events in Crimped Connectors refer to? - February 21, 2021