Assembly Processes, Packaging and Assembly, Packaging Design, Plastic Packaging for Space

A Bonding Relationship – K&S IConn ProCu PLUS & Alter Technology UK

Posted by doEEEt Media Group
On July 28, 2021
0

Offering end-to-end backend semiconductor manufacturing, from wafer singulation to assembled product, the company’s design and process IP enables customers to reduce development and manufacturing costs plus reduce time to market.

Small Sats Testing

Component packaging solution for New Space missions

Posted by doEEEt Media Group
On July 2, 2021
0

Assembly of initial prototypes and small quantities into cavity packages can be provided in Europe, this is only cost-effective for 10 units.  Users with low to medium applications such as space, medical, industrial, and aerospace struggle to find assembly at reasonable costs. They are never likely to reach volumes that are attractive to high-volume OSATs.  Small batches requiring numerous set-ups and a stop-start of production lines make factories very inefficient in an age where efficiency is critical to their survival and cost structure.

EEE Components, PASSIVES

Embedded Components in Printed Circuit Boards Explained

Posted by doEEEt Media Group
On January 20, 2021
0

Würth Elektronik Webinar

Miniaturisation? Integration of functions? Increased reliability? IP protection? All this is possible by embedding components into the printed circuit board.

The technology for this is called Embedding Technology (ET) and is characterized by different variants that can be used depending on the type of components. This creates completely new...

Plastic Packaging for Space

Europe´s first plastic package line for space applications

Posted by doEEEt Media Group
On July 28, 2020
1

As the demand and use of non-hermetic and plastic-encapsulated microcircuits for space have increased, the scope of what future missions are capable of has also widened. This activity feeds into other business within ATG with regards to New Space and COTS devices.

ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Considering the risk of retinning on QFN package

Posted by Manuel Sánchez Ruiz
On May 19, 2020
0

The use of new packages on space market has come hand in hand with the introduction of commercial of the shelf (COTS) parts in the business and even more with the New Space needs.