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EEE Components, PASSIVES

METCOM Metal Composite Power Inductors Automotive MPXV Announcement

  • Posted by Kemet Electronic Corporation
  • On April 28, 2020
  • 0
Kemet video is introducing a unique, metal composite power inductor that can meet the strict reliability requirements of the automotive industry. Part of our new METCOM line, MPXV high-reliability power inductors feature very gradual core saturation, remarkably stable inductance, minimal core loss, minimal flux leakage, and EMI reduction, all available in a variety of industry-standard footprints.
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EEE Components, PASSIVES

Common and Dual Mode Chokes for Automotive Applications in DC and AC Conditions

  • Posted by Kemet Electronic Corporation
  • On April 27, 2020
  • 0
Chokes are commonplace devices in nearly all electronics. As the electric content grows in automobiles, the need for chokes is also increasing. Being an automotive technology mean standing extending reliability and robustness.
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EEE Components, PASSIVES

Power Inductor for Buck & Boost Application & Noise Reduction Filtering for Low Volt

  • Posted by Kemet Electronic Corporation
  • On April 27, 2020
  • 0
Power inductors are commonplace in switched-mode power supplies used in nearly all electronic systems. Switching regulators are also sources of unwanted noise and the selection of components, such as inductors, can help intrinsically mitigate noise.
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EEE Components, PASSIVES

Capacitance Package, Minimizing Footprint while Maximizing

  • Posted by Kemet Electronic Corporation
  • On April 17, 2020
  • 0
KEMET KONNEKT™ package allows two to four ceramic capacitors to be stacked vertically or horizontally while retaining the integrity of the part. It uses transient liquid phase sintering (TLPS) technology to bond component terminations together. The KONNEKT™ U2J capacitors can be used in both orientations, thus minimizing the component footprint, while maximizing the bulk capacitance of a stacked MLCC with design flexibility in mind.
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EEE Components, PASSIVES, SPECIFICATIONS / QPLs

KEMET SMD BME MLCCs: QPL LISTED PER MIL-PRF-32535

  • Posted by Kemet Electronic Corporation
  • On March 19, 2020
  • 0
KEMET MIL-PRF-32535 surface mount capacitors using BME technology,are QPL listed in M and T product levels,getting same Capacitance and Voltage Size than MIL-PRF-123 or MIL-PRF-55681, in Smaller Case
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MANUFACTURER NOTIFICATION

KEMET Stockholders Approve Proposed Acquisition by Yageo

  • Posted by doEEEt Media Group
  • On March 10, 2020
  • 0
KEMET Corporation announced that its stockholders have voted to approve the proposed acquisition by Yageo Corporation. Approximately 96% of the votes cast, and 68% of the shares outstanding and entitled to vote, voted in favour of the transaction at the special meeting of KEMET stockholders (the “Special Meeting”).
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ACTIVES, EEE Components, PASSIVES, SPECIFICATIONS / QPLs

Issue 39 of EUROPEAN PREFERRED PARTS LIST (EPPL)

  • Posted by Emilio Cano García
  • On March 10, 2020
  • 0
The changes in issue 39 of EUROPEAN PREFERRED PARTS LISTS (EPPL) are included in the DCR 1310 and detailed in this post
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EEE Components, PASSIVES

DC-Link Capacitors Design Tips

  • Posted by Kemet Electronic Corporation
  • On January 19, 2020
  • 0
DC-Link capacitors can improve system energy density and resolve the physical challenges of ripples introduced by rapid switching that is inherent to switching power conversions.
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EEE Components, PASSIVES

What’s better… An assembled or a molded inductor?

  • Posted by Kemet Electronic Corporation
  • On January 2, 2020
  • 0

Kemet is showing performance differences between molded and assembled inductor in its Kemet Application Engineering Intelligence Center (KAIC).

Step into our KAIC Lab so you can see the difference between the two power inductors:

  • moulded

versus

  • assembled

and see what would work better for your next design project.

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EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Failure Analysis of Capacitors and Inductors

  • Posted by Kemet Electronic Corporation
  • On December 17, 2019
  • 0
General construction of Tantalum, Aluminum electrolytic, Multi-layer Ceramics, Film, and Super capacitors and Common Mode Choke and Surface Mount inductors are explained.
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