INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Material Analysis Techniques for Electronic Components

Posted by Francisco Javier Aparicio Rebollo
On May 6, 2022
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Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify potential reliability issues such as undesirable whisker growth caused by pure tin finishes. Lead finish validation for every component type to be soldered is essencial to determine the correct soldering profile.

INSPECTION, ELECTRICAL & VERIFICATION

Constructional Analysis Tests

Posted by doEEEt Media Group
On April 26, 2022
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Constructional Analysis as a complete service provides a deep understanding of the technologies used during the manufacturing process, information about the construction of their device

ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

A comparison between Red Plague screening methods

Posted by Manuel Sánchez Ruiz
On February 1, 2021
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Red Plague is problematic corrosion appearing on silver-plated copper conductors. An electromechanical reaction is induced between copper core and silver plating of the conductor (by means of moisture and oxygen present in the silver-copper interface). Wire affected by Red Plague is mechanically compromised, increasing the failure risk linked to severe vibration and shock conditions on space flight.

ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Considering the risk of retinning on QFN package

Posted by Manuel Sánchez Ruiz
On May 19, 2020
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The use of new packages on space market has come hand in hand with the introduction of commercial of the shelf (COTS) parts in the business and even more with the New Space needs.

ABC of CLR, EEE Components, PASSIVES

Thermal Noise, Current Noise & Corrosion on Resistors

Posted by Tomáš Zedníček
On March 6, 2020
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Noise manifests itself as a spontaneously fluctuating voltage whose instantaneous amplitude is randomly distributed. The instantaneous value is both unpredictable and of minor interest except in certain critical applications. Instead, one measures a time-averaged value. It consists of the root of the mean-square value of voltage transmitted in a particular frequency pass band.

ACTIVES, EEE Components, ENDURANCE, ENVIRONMENTAL & RADIATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Hermetic Packages in Space Environment

Posted by Javier Alejandro de la Ossa Fernández
On February 27, 2020
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The general specification for hybrid microcircuits (MIL-PRF-38534) details the qualification and testing requirements for non-hermetic packages for military and space applications, and the MIL-PRF-38535 proposed class Y monolithic microcircuits for non-hermetic space level.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Degolding on NiPdAu finish

Posted by Manuel Sánchez Ruiz
On December 30, 2019
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The use of gold (Au) finish on military and space qualified parts provides useful protection to the base material of leads during storage of the parts. The use of a gold layer over the barrier metal on the lead avoids the appearance of corrosion.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY

Hot Solder Dip Acceptance Criteria

Posted by Antonio Rodríguez Arenas
On December 20, 2019
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Hot Solder Dip Acceptance Criteria for Flat Pack Packages. Different standards can be considered to determine the acceptance of the Hot Solder Dip activity on EEE components

ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Advanced Techniques in EEE Components Testing for Space applications

Posted by doEEEt Media Group
On June 24, 2019
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The reliability of the components used in a spacecraft is a determinating factor for their operation and performance throughout the mission life. Only the most advanced techniques are able to provide the depth and accuracy in the inspections required by current state of the art microelectronics.

ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Video Digging into Circuit Alter Technology

Posted by doEEEt Media Group
On June 17, 2019
0

For satellite applications where failure is not an option, electronic components need to operate constantly on demand, and have to be free of failures during the lifetime of the satellite-which can be for many years. To ensure this requirement is met, the components are put through many hours of stress testing covering all thermal.