INSPECTION, ELECTRICAL & VERIFICATION, TESTING

SAM Capabilities, Analyse the internal structure in EEE Parts

Posted by Francisco Javier Aparicio Rebollo
On February 24, 2021
0

In acoustic microscopy, resolution and inspection depth is an inversely related parameter that depends on the probe frequency and the characteristics of the involved materials. Therefore, the inspection frequency must be carefully selected in order to optimize the accuracy without decreasing the inspection depth below the specimen thickness. Suitable selection of the inspection parameters provides: Detection of ultra-thin (submicrometric) delamination in multilayer systems. Micrometric lateral resolution. In acoustic microscopy, resolution and inspection depth is an inversely related parameter that depends on the probe frequency and the characteristics of the involved materials.

EEE Components, ENDURANCE, ENVIRONMENTAL & RADIATION, PASSIVES, TESTING

ESR Degradation in Polymer Tantalum Capacitors during Hi Temp Storage

Posted by doEEEt Media Group
On December 27, 2020
0

Different types of polymer capacitors from three manufacturers have been stored at temperatures from 100 ºC for periods up to 18,500 hours to 175 ºC for up to 2000 hours.

Plastic Packaging for Space

OpAmps in Plastic Packages

Posted by Francisco Javier Aparicio Rebollo
On December 17, 2020
0

Plastic encapsulated Op-amps are very popular due to the high availability and the diverse applications where they are implemented to. Nevertheless, they suffer from different risks being interfacial delamination and die attach anomalies the most critical ones. Scanning Acoustic inspection is the most suitable tool to avoid and...

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

SAM, the preferred method for the non-destructive internal inspection

Posted by doEEEt Media Group
On December 16, 2020
0

SAM, The Preferred Method For The Non-Destructive Internal Inspection. Scanning Acoustic Microscopy of COTS and plastic encapsulated microelectronics. Confocal Scanning Acoustic Microscopy (C-SAM) has proved to be the most effective non-destructive approach for the screening of COTS parts and the detection of latent internal anomalies in PEMs, either before soldering or for assembled systems.

INSPECTION, ELECTRICAL & VERIFICATION, Plastic Packaging for Space

SAM: Main Issues in Plastic Encapsulated Systems

Posted by Francisco Javier Aparicio Rebollo
On November 17, 2020
0

Plastic Encapsulated COTS offers Lower procurement cost, Shorter procurement time, More performance and functionality available nad Reduced size and weight. An inherent risk of PEMs is related to Lack of hermeticity, The mismatch with the thermomechanical properties of the inorganic internal part and Plastic Encapsulated COTS

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

SAM: Test flow and procedures

Posted by Francisco Javier Aparicio Rebollo
On September 17, 2020
0

Nowadays scanning acoustic microscopy (SAM) is extensively used in the non-destructive inspection of microelectronic devices and is present in different space verification programs; particularly for plastic-encapsulated electronic components. This is so due to the ability to image the internal morphology, location, size and distribution of hidden features including different types of flaws.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

C-SAM Questions & Answers

Posted by Francisco Javier Aparicio Rebollo
On July 7, 2020
0

In this post, you can read all the questions launched by the attendees, as well as all the answers offered by the speaker.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Non-destructive internal inspection of EEE parts and passive components

Posted by Francisco Javier Aparicio Rebollo
On July 7, 2020
0

Non-destructive testing methods are critical for the screening, inspection and failure analysis of plastic encapsulated and other EEE systems.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

SAM Test methods: comparisons

Posted by Francisco Javier Aparicio Rebollo
On June 17, 2020
0

Additional testing: This deviation is considered as a reliability concern and additional tests must be conducted to check the system performance. From the point of view of the SAM inspection, such deviations do not comply with the acceptance criterion

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Alter Technology SAM Additional Testing Capabilities

Posted by Francisco Javier Aparicio Rebollo
On January 29, 2020
0

Among the test flow where SAM microscopy is used, other tests are carried out in which Alter Technology also has extensive experience, giving its customers the possibility of doing all the necessary tests with our expert engineers, offering support and follow-up at all times thanks to Virtual Lab; where immediate access is generated and in real time to all the information on the parts examined.

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