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    • LABORATORY STANDARD TESTING
    • NON STANDARD TESTING
    • SILICON CARBIDE -SiC- DIODES
    • CROWDTESTING
    • OPTOELECTRONICS
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    • REPRESENTATIVE PROJECTS / PAPERS
  • Additional Services
    • INDUSTRY 4.0 CYBERSECURITY (IEC 62443)
    • PENETRATION TEST
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PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Why do a Residual Gas Analysis?

  • Posted by Dimas Morilla
  • On August 28, 2020
  • 0
Residual Gas Analysis, also known as Internal Gas Analysis (IGA), is a destructive test which is performed to examine the atmosphere inside hermetically sealed devices. The test procedure is based on milling the component so that the gas content can be extracted and subsequently analyzed. The measurement of the moisture content is of particular interest as it allows to determine whether the moisture criteria are met. Also, the measurement of all the other gases might be of interest as the gas content reflects upon the quality of the sealing process and can cause long term reliability problems such as corrosion, fogging, leakage, etc.
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PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Which are the improper degrees of Crimped Connectors?

  • Posted by Francisco Javier Aparicio Rebollo
  • On August 21, 2020
  • 0
Stress relaxation: decrease of the contact pressure held between the wires and at the wire-barrel interface, Improper crimping: neither damage the insulation of the wire strands nor to leave insulator residues over the stripped conductor. Diagnosis tools: improper degree of compression and related issues can be detected either
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Microsectioning - Short Technical Notes, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Plating Thickness Testing Overview in Alter Technology Lab.

  • Posted by Mari Carmen López
  • On July 28, 2020
  • 0
Cross-sectioned ceramic capacitors were metallographically prepared in the Materials & Processes Laboratory, recognized as a recommended facility for such activity by the ESA authority (MEMO ESA-TECMSP-MO-013165).
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Microsectioning - Short Technical Notes, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Evaluation of PCB in Alter Technology Lab.

  • Posted by Mari Carmen López
  • On July 25, 2020
  • 0
The separation of the interest area has to be performed in such a way as to prevent any damage by deformation or input of heat. After cleaning, the specimen is encapsulated before the grinding process takes place.
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INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

MIL-STD-883 METHOD 2003 – Solderability Testing

  • Posted by Manuel Padial Pérez
  • On July 23, 2020
  • 0
The Mil-Std-883 Method 2003 Is One Of The Oldest And Most Widely Used Standards For Solderability Testing.
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Microsectioning - Short Technical Notes, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Evaluation of Electronic Assemblies

  • Posted by Mari Carmen López
  • On July 18, 2020
  • 0
Assembly process of THT or SMT onto PCBs for spacecraft applications follow well-established design requirements based on specifications prepared by ECSS (ECSS-Q-ST-70-08C & ECSS-Q-ST-70-38C), NASA and IPC (IPC-6012).
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Microsectioning - Short Technical Notes, PHYSICAL, MECHANICAL & ASSEMBLY

Failure Analysis in Microsection Inspection

  • Posted by Mari Carmen López
  • On July 10, 2020
  • 0
Microsection analysis is performed on an assembled through hole device as a part of a failure analysis. Cross-section through the plane of interest can provide helpfully information about solder defects, PCB inner layers and internal construction. As a part of a failure analysis, the plane of interest has to be selected taking into account PCB characteristic, observed failure and previous test results.
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PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Product Assurance Approach Questions & Answers

  • Posted by doEEEt Media Group
  • On July 9, 2020
  • 0
In this post, you can read all the questions launched by the attendees, as well as all the answers offered by the speaker.
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PHYSICAL, MECHANICAL & ASSEMBLY, TESTING, WEBINAR

Scanning Acoustic Microscopy – Webinar

  • Posted by doEEEt Media Group
  • On June 17, 2020
  • 2
This webinar provides a brief overview of Scanning Acoustic Microscopy and the inspection of EEE parts. Thus, you will acquire, in a friendly way, the knowledge to interpret SAM images and to conceive basic SAM inspections. The webinar is mainly focused on the plastic encapsulated systems. In addition, we will also show other interesting application examples.
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EEE Components, Microsectioning - Short Technical Notes, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Microsectioning inspection of assembled capacitors

  • Posted by Mari Carmen López
  • On May 9, 2020
  • 0
Cross-sectioned ceramic capacitors were metallographically prepared in the Materials & Processes Laboratory, recognized as a recommended facility for such activity by the ESA authority (MEMO ESA-TECMSP-MO-013165).
Read More
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