Microsectioning

EEE Parts

The requirements about WHEN is neccesary to perform a DPA on a lot of EEE components are stablished in documents like ECSS-Q-ST-60C, ECSS-Q-ST-60-13C for commercial EEE components… and/or at project level.

The requirement about WHAT to do and HOW are included in documents like Generic Specificacionts, ESCC Basic Specification No. 21001, MIL-STD Test Methods, NASA EEE-INST-002, NASA PEM-INST-001…

ALTER TECHNOLOGY has an accumulated experience on DPA on EEE parts and also in PCB microsectioning being a full acredited laboratory by ESA.

Microsectioning or Cross-sectioning is a failure analysis technique (performed during DPA) for mechanically exposing a plane of interest in a die or package for further analysis or inspection. It usually consists of sawing, grinding, polishing, and staining the specimen until the plane of interest is ready for inspection by optical or electron microscopy.

Components are microsectioned after potting in suitable epoxy resin so that a microscopic examination can be undertaken for the purpose of accurately locating, identifying and characterizing all the internal structural features of the samples in order to judge any defects against the criteria of the specification.

Typical components that require microsection are:

  • Diodes
  • Capacitors
  • Relays
  • Isolators
  • Fuses

ALTER TECHNOLOGY LABORATORY SERVICES

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