MIL-STD-883, Method 2035 Mechanical Test Method Standard for Microcircuits: Ultrasonic inspection of TAB bonds
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The purpose of this method is to detect unbonded and insufficiently bonded sites in TAB (Tape automated bonding) devices in the open package condition, through the measurement of bond area by means of Scanning Laser Acoustic Microscope (SLAM) techniques. It establishes methods and criteria for ultrasonic inspection of these TAB semiconductor devices.
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16/09/2019 0:00:00
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MIL-STD-883, Method 2035
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