Temperature/DC Bias MLCC Models for SPICE Simulations

Posted by doEEEt Media Group
On November 5, 2021
0

Taiyo Yuden provides various component libraries for microwave circuits, PI, and SI simulators. The recent release add long-time wished temperature/DC Bias Models on MLCC capacitors for HSPICE and Spectre simulations.

EEE Components, PASSIVES

Low Inductance, Direct Power DC Bus for Electric Drive Systems

Posted by doEEEt Media Group
On May 4, 2021
0

As DC currents increase along with switching frequencies in applications such as electric vehicles and hybrid electric vehicles, the performance demands on the DC power bus go beyond just the IR drop (i.e. voltage drop) and thermal considerations.

EEE Components, PASSIVES

Knowles Precision Devices Expands its Enhanced Safety-Certified SMD MLCC Capacitors

Posted by doEEEt Media Group
On May 4, 2021
0

The new capacitors offer customers a unique combination of capability and safety certification and meet the demands of AEC-Q200 standards, modems, and AC-DC power supplies where a lightning strike or other voltage transients represent a threat to electronic equipment.

EEE Components, PASSIVES

MLCCs in Wireless Power Transfer Resonant Circuits

Posted by Kemet Electronic Corporation
On May 4, 2021
0

Wireless power transfer offers many advantages, including the elimination of power cords and the increase of safety and durability. Reliability and safety are both critical for users and regulated by third parties. Selection and consideration of use of MLCC ceramic capacitors is discussed in this article published by Kemet blog.

EEE Components, PASSIVES

TDK Explains Soft Termination on Capacitors, Inductors, and Chip Beads

Posted by doEEEt Media Group
On March 27, 2021
0

Components operating in high vibration and wide operating temperature environments such, as automotive electronics, have to absorb both board flexure stress and stress from the expansion and contraction of solder joints due to thermal shock. Thereby manufactures have developed conductive soft resin-polymer as the thermo-mechanical shock absorber improving connection reliability compare to conventional electrodes. TDK has present its explanation in article below.

EEE Components, PASSIVES

Q2 Component Demand Improves but Instability Reigns

Posted by doEEEt Media Group
On March 26, 2021
0

“The electronics industry seems to be slowly coming out of crisis mode,” an industry executive told the Institute for Supply Management. “Lead times and costs have leveled out in some commodities, and dynamic random-access memory (DRAM) prices are actually coming down.”

EEE Components, PASSIVES

Importance of Oxide Electrodes for the Functional Properties of Ferroelectric Capacitors

Posted by doEEEt Media Group
On March 19, 2021
0

Ferroelectric materials are commonly used as a dielectric material of high capacitance ceramic capacitors (MLCC class II and III). Ferro/piezo-electric materials change their shape under an applied voltage or develop a voltage under deformation.

EEE Components, PASSIVES

Passive Automotive Electronics for 48V Systems and V2X

Posted by doEEEt Media Group
On March 18, 2021
0

The shift toward 48V subsystems and the integration of vehicle-to-everything (V2X) communication are two prime examples of significant advances in efficiency and safety, respectively. In both cases, new classes of electronic passives (capacitors, inductors, antennas, interconnect) are required to bring these technologies to mainstream products while meeting strict automotive regulatory standards.

EEE Components, PASSIVES

Advances in Capacitors for Miniature, High Reliability Electronics

Posted by doEEEt Media Group
On March 10, 2021
0

Tech Chat – AVX and Mouser

Chris Anderson chats with Ron Demcko of AVX about AVX’s ultra-miniature MLCCs and their high-reliability tantalum polymer capacitors in the Tech Chat by All About Circuits video series.

Source: All About Circuits

ACTIVES, EEE Components, PASSIVES

Advances in Film Capacitor Technology Enables Downsizing

Posted by Kemet Electronic Corporation
On March 10, 2021
0

Kemet Webinar

The constant miniaturisation trend, primarily driven by Moore’s Law, has affected all areas of electronics. Making things smaller doesn’t just make them easier to carry around; it enables a higher density of capabilities and features, as well as higher power densities and efficiencies. Generally, the first things to shrink are the...

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